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JANS2N2222AUB

Part # JANS2N2222AUB
Description Trans GP BJT NPN 50V 0.8A 3-Pin UB - Waffle Pack
Category TRANSISTOR
Availability In Stock
Qty 84
Qty Price
1 - 3 $67.95553
4 - 9 $54.05553
10 - 19 $50.96665
20 - 42 $47.36294
43 + $42.21480
Manufacturer Available Qty
Microsemi Corp
Date Code: 0117
  • Shipping Freelance Stock: 2
    Ships Immediately
Microsemi Corp
Date Code: 0246
  • Shipping Freelance Stock: 5
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New England Semi
Date Code: 0117
  • Shipping Freelance Stock: 3
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New England Semi
Date Code: 0117
  • Shipping Freelance Stock: 9
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New England Semi
Date Code: 9949
  • Shipping Freelance Stock: 3
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QPL
Date Code: 0117
  • Shipping Freelance Stock: 1
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Semicoa
Date Code: 9805
  • Shipping Freelance Stock: 61
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0060 Rev. 2 (100247) Page 4 of 6
NOTES:
Dimensions
1. Dimensions are in inches.
Symbol
Inches Millimeters
Note
2. Millimeters are given for general information only.
Min Max Min Max
3. Dimension CH controls the overall package thickness. When a BL .215 .225 5.46 5.71
window lid is used, dimension CH must increase by a minimum of BL2
.225 5.71
.010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). BW .145 .155 3.68 3.93
4. The corner shape (square, notch, radius) may vary at the BW2
.155 3.93
manufacturer's option, from that shown on the drawing. CH .061 .075 1.55 1.90 3
5. Dimensions LW2 minimum and L3 minimum and the appropriate L3
.003 .007 0.08 0.18 5
castellation length define an unobstructed three-dimensional space LH .029 .042 0.74 1.07
traversing all of the ceramic layers in which a castellation was LL1
.032 .048 0.81 1.22
designed. (Castellations are required on the bottom two layers, LL2
.072 .088 1.83 2.23
optional on the top ceramic layer.) Dimension LW2 maximum and LS .045 .055 1.14 1.39
L3 maximum define the maximum width and depth of the LW .022 .028 0.56 0.71
castellation at any point on its surface. Measurement of these LW2
.006 .022 0.15 0.56 5
dimensions may be made prior to solder dipping.
6. The co-planarity deviation of all terminal contact points, as defined
by the device seating plane, shall not exceed .006 inch (0.15mm) for Pin no. 1 2 3 4
solder dipped leadless chip carriers. Transistor Collector Emitter Base N/C
7. In accordance with ASME Y14.5M, diameters are equivalent to φx
symbology.
FIGURE 2. Physical dimensions, surface mount (UA version).
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0060 Rev. 2 (100247) Page 5 of 6
Dimensions
Dimensions
Symbol Inches Millimeters Note
Symbol
Inches Millimeters
Note
Min Max Min Max
Min Max Min Max
BH .046 .056 1.17 1.42
LS
1
.036 .040 0.91 1.02
BL .115 .128 2.92 3.25
LS
2
.071 .079 1.81 2.01
BW .085 .108 2.16 2.74
LW .016 .024 0.41 0.61
CL .128 3.25
r .008 .203
CW .108 2.74
r
1
.012 .305
LL1 .022 .038 0.56 0.96
r
2
.022 .559
LL2 .017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metalized areas.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 3. Physical dimensions, surface mount (UB version)
UB
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
T4-LDS-0060 Rev. 2 (100247) Page 6 of 6
Dimensions
Dimensions
Symbol Inches Millimeters Note
Symbol
Inches Millimeters
Note
Min Max Min Max
Min Max Min Max
BH .046 .071 1.17 1.80
LS
1
.036 .040 0.91 1.02
BL .115 .128 2.92 3.25
LS
2
.071 .079 1.81 2.01
BW .085 .108 2.16 2.74
LW .016 .024 0.41 0.61
CL .128 3.25
r .008 .203
CW .108 2.74
r
1
.012 .305
LL1 .022 .038 0.56 0.96
r
2
.022 .559
LL2 .017 .035 0.43 0.89
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metalized areas.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Connected to the lid braze ring.
5. In accordance with ASME Y14.5M, diameters are equivalent to φx symbology.
FIGURE 4. Physical dimensions, surface mount (UBC version, ceramic lid)
UBC
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