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LP2992IM5-1.8

Part # LP2992IM5-1.8
Description MICROPOWER 250 MA LOW-NOISE ULTRA LOW-DR - Tape and Reel
Category IC
Availability In Stock
Qty 890
Qty Price
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187 - 373 $0.46106
374 - 560 $0.43471
561 - 747 $0.40397
748 + $0.36006
Manufacturer Available Qty
National Semiconductor Corp
Date Code: 0506
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

LP2992
www.ti.com
SNVS171G NOVEMBER 2001REVISED MARCH 2013
REVERSE INPUT-OUTPUT VOLTAGE
The PNP power transistor used as the pass element in the LP2992 has an inherent diode connected between
the regulator output and input. During normal operation (where the input voltage is higher than the output) this
diode is reverse-biased.
However, if the output is pulled above the input, this diode will turn ON and current will flow into the regulator
output. In such cases, a parasitic SCR can latch which will allow a high current to flow into V
IN
(and out the
ground pin), which can damage the part.
In any application where the output may be pulled above the input, an external Schottky diode must be
connected from V
IN
to V
OUT
(cathode on V
IN
, anode on V
OUT
), to limit the reverse voltage across the LP2992 to
0.3V (see Absolute Maximum Ratings).
WSON MOUNTING
The WSON package requires specific mounting techniques which are detailed in Application Note # 1187
(literature number SNOA401). Referring to the section PCB Design Recommendations, it should be noted that
the pad style which should be used with the WSON package is the NSMD (non-solder mask defined) type.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area.
For the LP2992 in the NGD0006A 6-Lead WSON package, the junction-to-case thermal rating, θ
JC
, is 19°C/W,
where the case is actually the bottom of the package at the center of the DAP. The junction-to-ambient thermal
performance for the LP2992 in the NGD0006A 6-Lead WSON package, using the JEDEC standards is
summarized in the following table:
Board Thermal
θ
JC
θ
JA
Type Vias
JEDEC
None 19°C/W 282°C/W
2–Layer
1 19°C/W 94°C/W
2 19°C/W 78°C/W
JEDEC
4–Layer
4 19°C/W 66°C/W
6 19°C/W 62°C/W
Copyright © 2001–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LP2992
LP2992
SNVS171G NOVEMBER 2001REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision F (March 2013) to Revision G Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
14 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: LP2992
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LP2992AILD-1.5 ACTIVE WSON NGD 6 1000 TBD Call TI Call TI -40 to 125 L011A
LP2992AILD-1.5/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 L011A
LP2992AILD-1.8 ACTIVE WSON NGD 6 1000 TBD Call TI Call TI -40 to 125 L012A
LP2992AILD-1.8/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 L012A
LP2992AILD-3.3 ACTIVE WSON NGD 6 1000 TBD Call TI Call TI -40 to 125 L014A
LP2992AILD-3.3/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 L014A
LP2992AILD-5.0 ACTIVE WSON NGD 6 1000 TBD Call TI Call TI -40 to 125 L015A
LP2992AILD-5.0/NOPB ACTIVE WSON NGD 6 1000 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 L015A
LP2992AILDX-1.8 ACTIVE WSON NGD 6 4500 TBD Call TI Call TI -40 to 125 L012A
LP2992AILDX-1.8/NOPB ACTIVE WSON NGD 6 4500 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 L012A
LP2992AILDX-3.3 ACTIVE WSON NGD 6 4500 TBD Call TI Call TI -40 to 125 L014A
LP2992AILDX-3.3/NOPB ACTIVE WSON NGD 6 4500 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 L014A
LP2992AILDX-5.0 ACTIVE WSON NGD 6 4500 TBD Call TI Call TI -40 to 125 L015A
LP2992AILDX-5.0/NOPB ACTIVE WSON NGD 6 4500 Green (RoHS
& no Sb/Br)
CU SN Level-3-260C-168 HR -40 to 125 L015A
LP2992AIM5-1.5 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 LFBA
LP2992AIM5-1.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LFBA
LP2992AIM5-1.8 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 LFCA
LP2992AIM5-1.8/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LFCA
LP2992AIM5-2.5 ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 LFDA
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