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TPS75003RHLT

Part # TPS75003RHLT
Description INTERGRATED POWER MANAGEMENTIC - Cut TR (SOS)
Category IC
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Texas Instruments
Date Code: 0627
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

V
OUT
ǒ
t
Ǔ
+ V
OUT,SET
ǒ
1 * e
*
t
RC
Ǔ
T
90%
+ 2.3 @ 480x10
3
@ C
SS3
(
mF
)
V
OUT
+ V
FB
ǒ
R
3
R
4
)1
Ǔ
TPS75003
www.ti.com
SBVS052I OCTOBER 2004REVISED AUGUST 2010
Output Capacitor Selection (LDO)
A 2.2mF or greater capacitor is required near the output of the device to ensure stability. The LDO is stable with
any capacitor type, including ceramic. If improved transient response or ripple rejection is required, larger and/or
lower ESR output capacitors can be used.
Soft-Start (LDO)
The LDO uses an external soft-start capacitor, C
SS3
, to provide an RC-ramped reference voltage to the control
loop. (See the Functional Block Diagram.) This is a voltage-controlled soft-start, as compared to the
current-controlled soft-start used by the buck controllers. The start-up waveform can be approximated by
Equation 14:
(14)
where R = 480 × 10
3
and C = capacitance in mF from SS3 to GND. The time taken to reach 90% of final V
OUT
can be approximated by Equation 15:
(15)
Setting Output Voltage (LDO)
Output voltage is set using two resistors as shown in Figure 1. Output voltage is then calculated using
Equation 16:
(16)
where V
FB
= 0.507V.
Internal Current Limit (LDO)
The internal current limit of the LDO helps protect the regulator during fault conditions. When an over-current
condition is detected, the output voltage will be reduced until the current falls to a level that will not damage the
device. For good device reliability, the LDO should not operate at current limit.
Enable Pin (LDO)
The active high enable pin (EN3) can be used to put the device into shutdown mode. If shutdown and soft-start
capability are not required, EN3 can be tied to IN3.
Dropout Voltage (LDO)
The LDO uses a PMOS transistor to achieve low dropout. When (V
IN
V
OUT
) is less than the dropout voltage
(V
DO
), the pass device is in its linear region of operation, and the input-output resistance is the R
DS,ON
of the pass
transistor. In this region, the regulator is said to be out of regulation; ripple rejection, line regulation, and load
regulation degrade as (V
IN
– V
OUT
) falls much below 0.5V.
Transient Response (LDO)
The LDO does not have an on-chip pull-down circuit for output is over-voltage conditions. This feature permits
applications that connect higher voltage sources such as an alternate power supply to the output. This design
also results in an output overshoot of several percent if the load current quickly drops to zero. The amplitude of
overshoot can be reduced by increasing C
OUT
; the duration of overshoot can be reduced by adding a load
resistor.
Thermal Protection (LDO)
Thermal protection disables the output when the junction temperature, T
J
, reaches unsafe levels. When the
junction cools, the output is again enabled. Depending on power dissipation, thermal resistance, and ambient
temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the
regulator, protecting it from damage. For good long term reliability, the device should not be continuously
operated at or near thermal shutdown.
Copyright © 2004–2010, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): TPS75003
P
D
+
ǒ
V
IN3
*V
OUT3
Ǔ
I
OUT3
L1
IN3
OUT3
FB1
FB2
20
1
11
10
DGND
SS3
AGND
EN1
SS1
DGND
SW1
IN1
IS1
19
18
17
16
15
14
13
12
FB3
EN3
EN2
SS2
DGND
SW2
IN2
IS2
2
3
4
5
6
7
8
9
R6
R7
EN3
EN2
V
IN
EN1
V
IN
C5,
C18
C3,
C17
C7
R5
C10
C12, C16
C13, C15
Q1
Q2
L2
V
OUT1
D2
C9
C6
V
OUT3
C14
C8
R9
D1
R8
V
OUT2
R4
C1
V
IN
TPS75003
SBVS052I OCTOBER 2004REVISED AUGUST 2010
www.ti.com
Power Dissipation (LDO)
The TPS75003 comes in a QFN-style package with an exposed lead frame on the package underside. The
exposed lead frame is the primary path for removing heat and should be soldered to a PC board that is
configured to remove the amount of power dissipated by the LDO, as calculated by Equation 17:
(17)
Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required
output voltage. The two buck converters do not contribute a significant amount of dissipated power. Using
heavier copper will increase the overall effectiveness of removing heat from the device. The addition of plated
through-holes to heat-dissipating layers will also improve the heatsink effectiveness.
PCB Layout Considerations
As with any switching regulators, careful attention must be paid to board layout. A typical application circuit and
corresponding recommended printed circuit board (PCB) layout with emphasis on the most sensitive areas are
shown in Figure 26 through Figure 28.
Note: Most sensitive areas are highlighted by bold lines.
Figure 26. Typical Application Circuit
20 Submit Documentation Feedback Copyright © 2004–2010, Texas Instruments Incorporated
Product Folder Link(s): TPS75003
TPS75003
www.ti.com
SBVS052I OCTOBER 2004REVISED AUGUST 2010
Note: Most sensitive areas are highlighted in green.
Figure 27. Recommended PCB Layout, Component Side, Top View
Copyright © 2004–2010, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Link(s): TPS75003
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