MSP430x22x2, MSP430x22x4
MIXED SIGNAL MICROCONTROLLER
SLAS504B − JULY 2006 − REVISED JULY 2007
23
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
absolute maximum ratings (see Note 1)
Voltage applied at V
CC
to V
SS
−0.3 V to 4.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note 2) −0.3 V to V
CC
+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal ±2 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
(unprogrammed device, see Note 3) −55°C to 150°C. . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
(programmed device, see Note 3) −40°C to 105°C. . . . . . . . . . . . . . . . . . . . .
NOTES: 1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
2. All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage
is applied to the TEST pin when blowing the JTAG fuse.
3. Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with
peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
recommended operating conditions
MIN NOM MAX UNIT
Supply voltage during program execution, V
CC
1.8 3.6 V
Supply voltage during program/erase flash memory, V
CC
2.2 3.6 V
Supply voltage, V
SS
0 V
Operating free air temperature T
I version −40 85
Operating free-air temperature, T
A
T version −40 105
°C
V
CC
= 1.8 V,
Duty cycle = 50% ±10%
dc 4.15
Processor frequency f
SYSTEM
(maximum MCLK frequency)
(see Notes 1, 2 and Figure 1)
V
CC
= 2.7 V,
Duty cycle = 50% ±10%
dc 12
MHz
V
CC
≥ 3.3 V,
Duty cycle = 50% ±10%
dc 16
NOTES: 1. The MSP430 CPU is clocked directly with MCLK.
Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency.
2. Modules might have a different maximum input clock specification. Refer to the specification of the respective module in this data
sheet.
4.15 MHz
12 MHz
16 MHz
1.8 V 2.2 V 2.7 V 3.3 V 3.6 V
Supply Voltage −V
System Frequency −MHz
Supply voltage range,
during flash memory
programming
Supply voltage range,
during program execution
Legend:
7.5 MHz
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V
CC
of 2.2 V.
Figure 1. Operating Area
