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IRFP460N

Part # IRFP460N
Description MOSFET N-Chan 500V 20 Amp
Category IC
Availability In Stock
Qty 10
Qty Price
1 - 2 $17.17426
3 - 4 $13.66134
5 - 6 $12.88069
7 - 8 $11.96994
9 + $10.66886
Manufacturer Available Qty
Harris Corporation
Date Code: 9331
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

www.irf.com 1
05/22/01
IRFP460N
SMPS MOSFET
HEXFET
®
Power MOSFET
l Switch Mode Power Supply ( SMPS )
l Uninterruptable Power Supply
l High speed power switching
Benefits
Applications
l Low Gate Charge Qg results in Simple
Drive Requirement
l Improved Gate, Avalanche and dynamic
dv/dt Ruggedness
l Fully Characterized Capacitance and
Avalanche Voltage and Current
l Effective Coss specified ( See AN1001)
V
DSS
Rds(on) max I
D
500V 0.24 20A
Typical SMPS Topologies:
l Full Bridge
l PFC Boost
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 20
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 13 A
I
DM
Pulsed Drain Current 80
P
D
@T
C
= 25°C Power Dissipation 280 W
Linear Derating Factor 2.2 W/°C
V
GS
Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 150
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torqe, 6-32 or M3 screw 10 lbfin (1.1Nm)
Absolute Maximum Ratings
Notes through are on page 8
TO-247AC
PD-94098
IRFP460N
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
g
fs
Forward Transconductance 10 ––– ––– SV
DS
= 50V, I
D
= 12A
Q
g
Total Gate Charge ––– ––– 124 I
D
= 20A
Q
gs
Gate-to-Source Charge ––– ––– 40 nC V
DS
= 400V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 57 V
GS
= 10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 23 ––– V
DD
= 250V
t
r
Rise Time ––– 87 ––– I
D
= 20A
t
d(off)
Turn-Off Delay Time ––– 34 ––– R
G
= 4.3
t
f
Fall Time ––– 33 ––– R
D
= 13,See Fig. 10
C
iss
Input Capacitance ––– 3540 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 350 ––– V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 30 ––– pF ƒ = 1.0MHz, See Fig. 5
C
oss
Output Capacitance ––– 3930 ––– V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 95 ––– V
GS
= 0V, V
DS
= 400V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 200 ––– V
GS
= 0V, V
DS
= 0V to 400V
Dynamic @ T
J
= 25°C (unless otherwise specified)
ns
Parameter Typ. Max. Units
E
AS
Single Pulse Avalanche Energy ––– 340 mJ
I
AR
Avalanche Current ––– 20 A
E
AR
Repetitive Avalanche Energy ––– 28 mJ
Avalanche Characteristics
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.8 V T
J
= 25°C, I
S
= 20A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 550 825 ns T
J
= 25°C, I
F
= 20A
Q
rr
Reverse RecoveryCharge ––– 7.2 10.8 µC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Diode Characteristics
20
80
A
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.45
R
θCS
Case-to-Sink, Flat, Greased Surface 0.24 ––– °C/W
R
θJA
Junction-to-Ambient ––– 40
Thermal Resistance
Static @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 500 ––– ––– VV
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient
––– 0.58 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 0.24 V
GS
= 10V, I
D
= 12A
V
GS(th)
Gate Threshold Voltage 3.0 ––– 5.0 V V
DS
= V
GS
, I
D
= 250µA
––– ––– 25
µA
V
DS
= 500V, V
GS
= 0V
––– ––– 250 V
DS
= 400V, V
GS
= 0V, T
J
= 125°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 30V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -30V
I
GSS
I
DSS
Drain-to-Source Leakage Current
IRFP460N
www.irf.com 3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.001
0.01
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
12V
10V
9.0V
8.0V
7.0V
6.0V
5.0V
V , Drain-to-Source Volta
g
e (V)
I , Drain-to-Source Current (A)
DS
D
5.0V
0.1
1
10
100
0.1 1 10 100
20
µ
s PULSE WIDTH
T = 150 C
J
°
TOP
BOTTOM
VGS
15V
12V
10V
9.0V
8.0V
7.0V
6.0V
5.0V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
5.0V
0.1
1
10
100
5 6 7 8 9 10 11
V = 50V
20
µ
s PULSE WIDTH
DS
V , Gate-to-Source Volta
g
e (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 150 C
J
°
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
20A
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