CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
http://onsemi.com
18
PACKAGE DIMENSIONS
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE C
SEATING
PLANE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-
TACT BALL DIAMETER PARALLEL TO DATUM C.
2X
DIM
A
MIN MAX
0.29
MILLIMETERS
A1
D 0.86 BSC
E
b 0.14 0.18
e 0.30 BSC
0.39
D
E
A
B
PIN A1
REFERENCE
e
0.05 C
5X
b
13
C
A
0.10 C
A1
A
C
0.10 0.14
0.84 BSC
0.10 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
e1
A2 0.23 REF
PITCH
0.16
5X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.52
0.30
RECOMMENDED
A1
PACKAGE
OUTLINE
PITCH
NOTE 3
A2
NOTE 4
A
M
0.10 BC
e1 0.52 BSC
PIN A1
REFERENCE
B
2
5X
