• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1
Flip Chip PIN Diode
RoHS Compliant
Rev. V4
MA4FCP305
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Features
• Low Series Resistance : 1.7Ω
• Low Capacitance : 50fF
• Fast Switching Speed : 20nS
• Silicon Nitride Passivation
• Polyimide Scratch Protection
• Designed for Automated Pick and Place Insertion
• Rugged by Design
Description
M/A-COM’s MA4FCP Series consists of Silicon Flip
Chip PIN diodes fabricated with M/A-COM’s
patented HMIC process. This diode is fabricated on
epitaxial wafers using a process designed for
repeatable electrical characteristics and extremely
low parasitics. This diode is fully passivated with
Silicon Nitride and has an additional layer of
Polyimide for scratch protection. These protective
coatings prevent damage to the junction during
automated or manual handling. This flip chip
configuration is suitable for pick and place insertion.
Applications
The small 0315 outline and low 0.085 pS RC
product, make the device useful for multi-throw
switch and switched phase shifter circuits requiring
<20nS switching speeds up to 18GHz operating
frequency.
Absolute Maximum Ratings
@ TA = +25°C (unless otherwise specified)
1. Exceeding these limits may cause permanent damage.
1. Backside metal: 0.1 μM thick.
2. Yellow hatched areas indicate backside ohmic gold
contacts.
Parameter Absolute Maximum
Forward Current
100 mA
Reverse Voltage - 40 V
Operating Temperature - 55°C to + 150°C
Storage Temperature - 55°C to + 150°C
Dissipated Power 230 mW
Mounting Temperature +300°C for 10 seconds
1269 Outline
Dim.
Inches Millimeters
Min. Max. Min. Max.
A 0.0269 0.0289 0.683 0.733
B 0.0135 0.0155 0.343 0.393
C 0.0040 0.0080 0.102 0.203
D 0.0041 0.0061 0.105 0.155
E 0.0124 0.0144 0.315 0.365
F 0.0069 0.0089 0.175 0.225
