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Material Content Data Sheet
Sales Product Name IPD80R1K4CE Issued 29. August 2013
MA# MA001133458
Package PG-TO252-3-313 Weight* 319.29 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip inorganic material silicon 7440-21-3 3.894 1.22 1.22 12194 12194
leadframe non noble metal iron 7439-89-6 0.147 0.05 461
inorganic material phosphorus 7723-14-0 0.044 0.01 138
non noble metal copper 7440-50-8 147.096 46.07 46.13 460693 461292
wire non noble metal aluminium 7429-90-5 0.525 0.16 0.16 1644 1644
encapsulation organic material carbon black 1333-86-4 1.399 0.44 4381
plastics epoxy resin - 24.478 7.67 76662
inorganic material silicondioxide 60676-86-0 113.996 35.70 43.81 357027 438070
leadfinish non noble metal tin 7440-31-5 3.740 1.17 1.17 11714 11714
plating inorganic material phosphorus 7723-14-0 0.003 0.00 11
non noble metal nickel 7440-02-0 1.421 0.44 0.44 4449 4460
solder noble metal silver 7440-22-4 0.084 0.03 262
non noble metal tin 7440-31-5 0.067 0.02 210
non noble metal lead 7439-92-1 3.198 1.00 1.05 10014 10486
heatspreader non noble metal iron 7439-89-6 0.019 0.01 60
inorganic material phosphorus 7723-14-0 0.006 0.00 18
non noble metal copper 7440-50-8 19.177 6.01 6.02 60062 60140
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com
