Freelance Electronics Components Distributor
Closed Dec 25th-26th
800-300-1968
We Stock Hard to Find Parts

IRF640S

Part # IRF640S
Description MOSFET N-CH 200V 18A D2PAK
Category RECTIFIER
Availability Out of Stock
Qty 0
Qty Price
1 + $0.24552



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Philips Semiconductors Product specification
N-channel TrenchMOS transistor IRF640, IRF640S
FEATURES SYMBOL QUICK REFERENCE DATA
’Trench’ technology
• Low on-state resistance V
DSS
= 200 V
• Fast switching
• Low thermal resistance I
D
= 16 A
R
DS(ON)
180 m
GENERAL DESCRIPTION
N-channel, enhancement mode field-effect power transistor using Trench technology, intended for use in off-line
switchedmode power supplies, T.V. and computer monitor power supplies, d.c. to d.c. converters,motor control circuits
and general purpose switching applications.
The IRF640 is supplied in the SOT78 (TO220AB) conventional leaded package.
The IRF640S is supplied in the SOT404 (D
2
PAK) surface mounting package.
PINNING SOT78 (TO220AB) SOT404 (D
2
PAK)
PIN DESCRIPTION
1 gate
2 drain
1
3 source
tab drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DSS
Drain-source voltage T
j
= 25 ˚C to 175˚C - 200 V
V
DGR
Drain-gate voltage T
j
= 25 ˚C to 175˚C; R
GS
= 20 k - 200 V
V
GS
Gate-source voltage - ± 20 V
I
D
Continuous drain current T
mb
= 25 ˚C; V
GS
= 10 V - 16 A
T
mb
= 100 ˚C; V
GS
= 10 V - 11 A
I
DM
Pulsed drain current T
mb
= 25 ˚C - 64 A
P
D
Total power dissipation T
mb
= 25 ˚C - 136 W
T
j
, T
stg
Operating junction and - 55 175 ˚C
storage temperature
d
g
s
13
tab
2
123
tab
1 It is not possible to make connection to pin:2 of the SOT404 package
August 1999 1 Rev 1.100
Philips Semiconductors Product specification
N-channel TrenchMOS transistor IRF640, IRF640S
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
E
AS
Non-repetitive avalanche Unclamped inductive load, I
AS
= 6.2 A; - 580 mJ
energy t
p
= 720 µs; T
j
prior to avalanche = 25˚C;
V
DD
25 V; R
GS
= 50 ; V
GS
= 10 V; refer
to fig;14
I
AS
Peak non-repetitive - 16 A
avalanche current
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction - - 1.1 K/W
to mounting base
R
th j-a
Thermal resistance junction SOT78 package, in free air - 60 - K/W
to ambient SOT404 package, pcb mounted, minimum - 50 - K/W
footprint
ELECTRICAL CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
Drain-source breakdown V
GS
= 0 V; I
D
= 0.25 mA; 200 - - V
voltage T
j
= -55˚C 178 - - V
V
GS(TO)
Gate threshold voltage V
DS
= V
GS
; I
D
= 1 mA 2 3 4 V
T
j
= 175˚C 1 - - V
T
j
= -55˚C - 6 V
R
DS(ON)
Drain-source on-state V
GS
= 10 V; I
D
= 8 A - 130 180 m
resistance T
j
= 175˚C - - 522 m
I
GSS
Gate source leakage current V
GS
= ± 20 V; V
DS
= 0 V - 10 100 nA
I
DSS
Zero gate voltage drain V
DS
= 200 V; V
GS
= 0 V; - 0.05 10 µA
current V
DS
= 160 V; V
GS
= 0 V; T
j
= 175˚C - - 250 µA
Q
g(tot)
Total gate charge I
D
= 18 A; V
DD
= 160 V; V
GS
= 10 V - - 63 nC
Q
gs
Gate-source charge - - 12 nC
Q
gd
Gate-drain (Miller) charge - - 35 nC
t
d on
Turn-on delay time V
DD
= 100 V; R
D
= 5.6 ; - 12 - ns
t
r
Turn-on rise time V
GS
= 10 V; R
G
= 5.6 -45-ns
t
d off
Turn-off delay time Resistive load - 54 - ns
t
f
Turn-off fall time - 38 - ns
L
d
Internal drain inductance Measured tab to centre of die - 3.5 - nH
L
d
Internal drain inductance Measured from drain lead to centre of die - 4.5 - nH
(SOT78 package only)
L
s
Internal source inductance Measured from source lead to source - 7.5 - nH
bond pad
C
iss
Input capacitance V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz - 1850 - pF
C
oss
Output capacitance - 170 - pF
C
rss
Feedback capacitance - 91 - pF
August 1999 2 Rev 1.100
Philips Semiconductors Product specification
N-channel TrenchMOS transistor IRF640, IRF640S
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
Continuous source current - - 16 A
(body diode)
I
SM
Pulsed source current (body - - 64 A
diode)
V
SD
Diode forward voltage I
F
= 18 A; V
GS
= 0 V - 1.0 1.5 V
t
rr
Reverse recovery time I
F
= 18 A; -dI
F
/dt = 100 A/µs; - 130 - ns
Q
rr
Reverse recovery charge V
GS
= 0 V; V
R
= 25 V - 0.8 - µC
August 1999 3 Rev 1.100
123NEXT