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IRF5210SPBF

Part # IRF5210SPBF
Description TRANS:HEXFET P-CHAN -100V D2PAK
Category RECTIFIER
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

IRF5210SPbF
IRF5210LPbF
HEXFET
®
Power MOSFET
PD - 97049A
V
DSS
= -100V
R
DS(on)
= 60m
I
D
= -38A
l Advanced Process Technology
l Ultra Low On-Resistance
l 150°C Operating Temperature
l Fast Switching
l Repetitive Avalanche Allowed up to Tjmax
l Some Parameters are Different from
IRF5210S/L
l P-Channel
l Lead-Free
05/22/06
S
D
G
www.irf.com 1
Absolute Maximum Ratings
Parameter Units
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ -10V
A
I
D
@ T
C
= 100°C
Continuous Drain Current, VGS @ -10V
I
DM
Pulsed Drain Current
P
D
@T
A
= 25°C
Maximum Power Dissipation W
P
D
@T
C
= 25°C
Maximum Power Dissipation
Linear Derating Factor W/°C
V
GS
Gate-to-Source Voltage V
E
AS
Single Pulse Avalanche Energy
mJ
I
AR
Avalanche Current
A
E
AR
Repetitive Avalanche Ener
gy
mJ
dv/dt
Peak Diode Recovery dv/dt
V/ns
T
J
Operating Junction and °C
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Thermal Resistance
Parameter Typ. Max. Units
R
θJC
Junction-to-Case –––
0.75
°C/W
R
θJA
Junction-to-Ambient (PCB Mount, steady state)
––– 40
170
1.3
± 20
0.017
120
-23
300 (1.6mm from case )
-55 to + 150
-7.4
Max.
-38
-24
-140
3.1
D
2
Pak
IRF5210SPbF
TO-262
IRF5210LPbF
S
D
G
D
S
D
G
D
GDS
Gate Drain Source
Description
Features of this design are a 150°C junction
operating temperature, fast switching speed and
improved repetitive avalanche rating . These fea-
tures combine to make this design an extremely
efficient and reliable device for use in a wide
variety of other applications.
IRF5210S/LPbF
2 www.irf.com
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11)
Starting T
J
= 25°C, L = 0.46mH
R
G
= 25, I
AS
= -23A. (See Figure 12)
I
SD
-23A, di/dt -650A/µs, V
DD
V
(BR)DSS
,
T
J
150°C.
Pulse width 300µs; duty cycle 2%.
When mounted on 1" square PCB (FR-4or G-10
Material). For recommended footprint and soldering
techniques refer to application note #AN-994.
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. T
y
p. Max. Units
V
(BR)DSS
Drain-to-Source Breakdown Volta
g
e-100V
∆ΒV
DSS
/
T
J
Breakdown Volta
g
e Temp. Coefficient ––– -0.11 –– V/°C
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 60
m
V
GS(th)
Gate Threshold Volta
g
e-2.0-4.0V
g
fs Forward Transconductance 9.5 ––– ––– S
I
DSS
Drain-to-Source Leaka
e Current ––– ––– -50 µA
––– ––– -250
I
GSS
Gate-to-Source Forward Leaka
g
e ––– ––– 100 nA
Gate-to-Source Reverse Leaka
g
e–-100
Q
g
Total Gate Char
g
e ––– 150 230 nC
Q
gs
Gate-to-Source Char
g
e ––– 22 33
Q
gd
Gate-to-Drain ("Miller") Char
g
e–81120
t
d(on)
Turn-On Dela
y
Time ––– 14 ––– ns
t
r
Rise Time ––– 63 –––
t
d(off)
Turn-Off Dela
y
Time –– 72 ––
t
f
Fall Time ––– 55 –––
L
D
Internal Drain Inductance ––– 4.5 ––– nH Between lead,
6mm (0.25in.)
L
S
Internal Source Inductance ––– 7.5 ––– from packa
g
e
and center of die contact
C
iss
Input Capacitance ––– 2780 ––– pF
C
oss
Output Capacitance ––– 800 –––
C
rss
Reverse Transfer Capacitance ––– 430 –––
Source-Drain Ratings and Characteristics
Parameter Min. T
y
p. Max. Units
I
S
Continuous Source Current ––– ––– -38
(Body Diode) A
I
SM
Pulsed Source Current ––– ––– -140
(
Bod
y
Diode
)
V
SD
Diode Forward Voltage
––– ––– -1.6 V
t
rr
Reverse Recovery Time
––– 170 260 ns
Q
rr
Reverse Recover
y
Char
g
e ––– 1180 1770 nC
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
V
DS
= V
GS
, I
D
= -250µA
V
DS
= -100V, V
GS
= 0V
V
DS
= -80V, V
GS
= 0V, T
J
= 125°C
Conditions
V
GS
= 0V, I
D
= -25A
Reference to 25°C, I
D
= -1mA
V
GS
= 10V, I
D
= -38A
T
J
= 2C, I
F
= -23A, V
DD
= -25V
di/dt = -100A/µs
T
J
= 2C, I
S
= -23A, V
GS
= 0V
showing the
integral reverse
p-n junction diode.
V
GS
= -10V
MOSFET symbol
V
GS
= 0V
V
DS
= -25V
Conditions
ƒ = 1.0MHz, See Fig. 5
R
G
= 2.4
I
D
= -23A
V
DS
= -50V, I
D
= -23A
V
DD
= -50V
I
D
= -23A
V
GS
= 20V
V
GS
= -20V
V
DS
= -80V
V
GS
= -10V
IRF5210S/LPbF
www.irf.com 3
Fig 4. Normalized On-Resistance
vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1 1 10 100
-V
DS
, Drain-to-Source Voltage (V)
0.1
1
10
100
1000
-
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
VGS
TOP -15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM -4.5V
60µs PULSE WIDTH
Tj = 25°C
-4.5V
0.1 1 10 100
-V
DS
, Drain-to-Source Voltage (V)
0.1
1
10
100
1000
-
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
-4.5V
60µs PULSE WIDTH
Tj = 150°C
VGS
TOP -15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM -4.5V
2 4 6 8 10 12 14
-V
GS
, Gate-to-Source Voltage (V)
0.1
1
10
100
1000
-
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
T
J
= 25°C
T
J
= 150°C
V
DS
= -50V
60µs PULSE WIDTH
-60 -40 -20 0 20 40 60 80 100120140160180
T
J
, Junction Temperature (°C)
0.5
1.0
1.5
2.0
R
D
S
(
o
n
)
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
O
n
R
e
s
i
s
t
a
n
c
e
(
N
o
r
m
a
l
i
z
e
d
)
I
D
= -38A
V
GS
= -10V
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