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Material Content Data Sheet
Sales Product Name SPW55N80C3 Issued 28. August 2013
MA# MA000920040
Package PG-TO247-3-41 Weight* 6062.37 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip inorganic material silicon 7440-21-3 39.403 0.65 0.65 6500 6500
leadframe non noble metal iron 7439-89-6 0.530 0.01 87
inorganic material phosphorus 7723-14-0 0.159 0.00 26
non noble metal copper 7440-50-8 529.068 8.73 8.74 87271 87384
wire non noble metal aluminium 7429-90-5 13.072 0.22 0.22 2156 2156
encapsulation organic material carbon black 1333-86-4 19.630 0.32 3238
plastics epoxy resin - 372.979 6.15 61524
inorganic material silicondioxide 60676-86-0 1570.437 25.90 32.37 259047 323809
leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5258 5258
plating non noble metal nickel 7440-02-0 29.065 0.48 0.48 4794 4794
solder non noble metal antimony 7440-36-0 1.367 0.02 225
noble metal silver 7440-22-4 3.417 0.06 564
non noble metal tin 7440-31-5 8.885 0.15 0.23 1466 2255
heatspreader non noble metal iron 7439-89-6 3.442 0.06 568
inorganic material phosphorus 7723-14-0 1.033 0.02 170
non noble metal copper 7440-50-8 3438.006 56.70 56.78 567106 567844
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com
