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SNJ54ALS10AJ

Part # SNJ54ALS10AJ
Description IC, TRIPLE 3-INPUT NAND14 PIN CDIP
Category MICROCIRCUITS
Availability In Stock
Qty 64
Qty Price
1 - 13 $5.26017
14 - 26 $4.18423
27 - 40 $3.94513
41 - 53 $3.66618
54 + $3.26768
Manufacturer Available Qty
Texas Instruments
Date Code: 9129
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Texas Instruments
Date Code: 9624
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Texas Instruments
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Texas Instruments
Date Code: 9623
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Texas Instruments
Date Code: 9013
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Texas Instruments
Date Code: 8712
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Texas Instruments
Date Code: 9119
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Texas Instruments
Date Code: 8726
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Date Code: 9119
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN74AS10NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS10NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54ALS10AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54ALS10AJ ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54ALS10AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54AS10FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54AS10J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
SN74ALS10ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74ALS10ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AS10DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AS10NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ALS10ADR SOIC D 14 2500 346.0 346.0 33.0
SN74ALS10ANSR SO NS 14 2000 346.0 346.0 33.0
SN74AS10DR SOIC D 14 2500 346.0 346.0 33.0
SN74AS10NSR SO NS 14 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
Pack Materials-Page 2
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