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Material Content Data Sheet
Sales Product Name BAR 88-02LRH E6327 Issued 29. August 2013
MA# MA000252211
Package PG-TSLP-2-7 Weight* 0.51 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip non noble metal tin 7440-31-5 0.000 0.07 710
noble metal gold 7440-57-5 0.001 0.27 2749
inorganic material silicon 7440-21-3 0.017 3.35 3.69 33546 37005
leadframe non noble metal nickel 7440-02-0 0.100 19.49 19.49 194863 194863
wire noble metal gold 7440-57-5 0.006 1.11 1.11 11061 11061
encapsulation organic material carbon black 1333-86-4 0.004 0.72 7195
plastics epoxy resin - 0.050 9.71 97142
inorganic material silicondioxide 60676-86-0 0.316 61.52 71.95 615234 719571
leadfinish noble metal gold 7440-57-5 0.010 1.88 1.88 18750 18750
plating noble metal gold 7440-57-5 0.010 1.88 1.88 18750 18750
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com
