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IRFL9014

Part # IRFL9014
Description MOSFET P-CH 60V 1.8A SOT223
Category Microcircuit
Availability Out of Stock
Qty 0
Qty Price
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Parameter Max. Units
I
D
@ Tc = 25°C Continuous Drain Current, V
GS
@ -10 V -1.8
I
D
@ Tc = 100°C Continuous Drain Current, V
GS
@ -10 V -1.1
I
DM
Pulsed Drain Current -14
P
D
@Tc = 25°C Power Dissipation 3.1
P
D
@T
A
= 25°C Power Dissipation (PCB Mount)** 2.0 W
Linear Derating Factor 0.025
Linear Derating Factor (PCB Mount)** 0.017 W/°C
V
GS
Gate-to-Source Voltage -/+20 V
E
AS
Single Pulse Avalanche Energy 140 mJ
I
AR
Avalanche Current -1.8 A
E
AR
Repetitive Avalanche Energy 0.31 mJ
dv/dt Peak Diode Recovery dv/dt -4.5 V/ns
T
J,
T
STG
Junction and Storage Temperature Range -55 to + 150
IRFL9014
HEXFET
®
Power MOSFET
PD - 90863A
V
DSS
= -60V
R
DS(on)
= 0.50
I
D
= -1.8A
Third Generation HEXFETs from International Rectifier
provide the designer with the best combination of fast
switching, ruggedized device design, low on-resistance
and cost-effectiveness.
The SOT-223 package is designed for surface-mount using
vapor phase, infra red, or wave soldering techniques. Its
unique package design allows for easy automatic pick-and-
place as with other SOT or SOIC packages but has the
added advantage of improved thermal performance due to
an enlarged tab for heatsinking. Power dissipation of
grreater than 1.25W is possible in a typical surface mount
application.
2/1/99
Description
l Surface Mount
l Available in Tape & Reel
l Dynamic dv/dt Rating
l Repetitive Avalanche Rated
l P-Channel
l Fast Switching
l Ease of Paralleling
SOT-223
** When mounted on 1'' SQUARE pcb (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994.
Parameter Typ. Max. Units
R
θJC
Junction-to-PCB ––– 40
R
θJA
Junction-to-Ambient. (PCB Mount)** –– 60
Thermal Resistance
°C/W
Absolute Maximum Ratings
A
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Soldewring Temperature, for 10 seconds
300 (1.6mm from case)
°C
S
D
G
IRFL9014
2 www.irf.com
R
DS(on)
Static Drain-to-Source On-Resistance 0.50 V
GS
= -10V, I
D
= 1.1A
V
GS(th)
Gate Threshold Voltage -2.0 ––– -4.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 1.3 ––– ––– S V
DS
= -25V, I
D
= 1.1A
––– ––– -100
µA
V
DS
= -60V, V
GS
= 0V
––– ––– -500 V
DS
= -48V, V
GS
= 0V, T
J
= 125°C
Gate-to-Source Forward Leakage ––– ––– -100
nA
V
GS
= -20V
Gate-to-Source Reverse Leakage ––– ––– 100 V
GS
= 20V
Q
g
Total Gate Charge ––– ––– 12 I
D
=-6.7A
Q
gs
Gate-to-Source Charge ––– ––– 3.8 nC V
DS
=-48V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 5.1 V
GS
= -10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 11 ––– V
DD
= -30V
t
r
Rise Time ––– 63 –––
ns
I
D
= -6.7A
t
d(off)
Turn-Off Delay Time ––– 9.6 ––– R
G
= 24
t
f
Fall Time ––– 31 ––– R
D
= 4.0 Ω, See Fig. 10
nH
C
iss
Input Capacitance ––– 270 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 170 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 31 ––– ƒ = 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
I
GSS
I
DSS
Drain-to-Source Leakage Current
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
-6.7A, di/dt ≤90A/µs, V
DD
V
(BR)DSS
,
T
J
150°C
Notes:
V
DD=
-25V, starting T
J
= 25°C, L =50 mH
R
G
= 25, I
AS
= -1.8A. (See Figure 12)
Pulse width 300µs; duty cycle 2%.
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode) showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– -5.5 V T
J
= 25°C, I
S
= -1.8A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 80 160 ns T
J
= 25°C, I
F
=-6.7A
Q
rr
Reverse RecoveryCharge ––– 0.096 0.19 µC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
––– –––
––– ––– -14
-1.8
A
Between lead, 6mm(0.25in)
from package and center
of die contact.
L
S Internal Source Inductance
Internal Drain Inductance
L
D
––– 4.0 –––
––– 6.0 –––
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– -0.059 ––– V/°C Reference to 25°C, I
D
= 1mA
V
(BR)DSS
Drain-to-Source Breakdown Voltage -60 ––– ––– V V
GS
= 0V, I
D
= 250µA
Parameter Min. Typ. Max. Units Conditions
Source-Drain Ratings and Characteristics
S
D
G
S
D
G
IRFL9014
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