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CD54HC564F3A

Part # CD54HC564F3A
Description Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element 20-
Category Microcircuit
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Date Code: 8346
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

1
Data sheet acquired from Harris Semiconductor
SCHS188C
Features
Buffered Inputs
Common Three-State Output-Enable Control
Three-State Outputs
Bus Line Driving Capability
Typical Propagation Delay = 13ns at V
CC
= 5V,
C
L
= 15pF, T
A
= 25
o
C (Clock to Output)
Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating Temperature Range . . . -55
o
C to 125
o
C
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: N
IL
= 30%, N
IH
= 30% of V
CC
at V
CC
= 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
IL
= 0.8V (Max), V
IH
= 2V (Min)
- CMOS Input Compatibility, I
l
1µA at V
OL
, V
OH
Description
The ’HC534, ’HCT534, ’HC564, and ’HCT564 are high speed
Octal D-Type Flip-Flops manufactured with silicon gate CMOS
technology. They possess the low power consumption of stan-
dard CMOS integrated circuits, as well as the ability to drive
15 LSTTL loads. Due to the large output drive capability and
the three-state feature, these devices are ideally suited for
interfacing with bus lines in a bus organized system. The two
types are functionally identical and differ only in their pinout
arrangements.
The ’HC534, ’HCT534, ’HC564, and ’HCT564 are positive
edge triggered flip-flops. Data at the D inputs, meeting the
setup and hold time requirements, are inverted and trans-
ferred to the Q outputs on the positive going transition of the
CLOCK input. When a high logic level is applied to the OUT-
PUT ENABLE input, all outputs go to a high impedance state,
regardless of what signals are present at the other inputs and
the state of the storage elements.
The HCT logic family is speed, function, and pin compatible
with the standard LS logic family.
Ordering Information
PART NUMBER
TEMP. RANGE
(
o
C) PACKAGE
CD54HC534F3A -55 to 125 20 Ld CERDIP
CD54HC564F3A -55 to 125 20 Ld CERDIP
CD54HCT534F3A -55 to 125 20 Ld CERDIP
CD54HCT564F3A -55 to 125 20 Ld CERDIP
CD74HC534E -55 to 125 20 Ld PDIP
CD74HC564E -55 to 125 20 Ld PDIP
CD74HC564M -55 to 125 20 Ld SOIC
CD74HC564M96 -55 to 125 20 Ld SOIC
CD74HCT534E -55 to 125 20 Ld PDIP
CD74HCT564E -55 to 125 20 Ld PDIP
CD74HCT564M -55 to 125 20 Ld SOIC
January 1998 - Revised April 2004
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2004, Texas Instruments Incorporated
CD54/74HC534, CD54/74HCT534,
CD54/74HC564, CD54/74HCT564
High-Speed CMOS Logic Octal D-Type Flip-Flop,
Three-State Inverting Positive-Edge Triggered
[ /Title
(CD74
HC534
,
C
D74
HCT53
4,
CD74
HC564
,
C
D74
HCT56
2
Functional Diagram
Pinouts
CD54HC534, CD54HCT534
(CERDIP)
CD74HC534, CD74HCT534
(PDIP)
TOP VIEW
CD54HC564, CD54HCT564
(CERDIP)
CD74HC564, CD74HCT564
(PDIP, SOIC)
TOP VIEW
TRUTH TABLE
INPUTS OUTPUT
OE CP Dn Qn
L HL
L LH
L L X No Change
HXXZ
H = High Level (Steady State)
L = Low Level (Steady State)
X= Don’t Care
= Transition from Low to High Level
Z = High Impedance State
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
OE
Q0
D0
D1
Q1
Q2
D3
D2
Q3
GND
V
CC
D7
D6
Q6
Q7
Q5
D5
D4
Q4
CP 11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
OE
D0
D1
D2
D3
D4
D6
D5
D7
GND
V
CC
Q1
Q2
Q3
Q0
Q4
Q5
Q6
Q7
CP
Q
0
D
0
CP
OE
Q
1
D
1
Q
2
D
2
Q
3
D
3
Q
4
D
4
Q
5
D
5
Q
6
D
6
O
7
D
7
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
CP CP CP CP CP CP CP CP
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For V
I
< -0.5V or V
I
> V
CC
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For V
O
< -0.5V or V
O
> V
CC
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < V
O
< V
CC
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, I
O
For V
O
> -0.5V or V
O
< V
CC
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC V
CC
or Ground Current, I
CC
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, T
A
. . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V
I
, V
O
. . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 1) θ
JA
(
o
C/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C -40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITSV
I
(V) I
O
(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage
V
IH
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage
V
IL
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or V
IL
-0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage
TTL Loads
- - ---- - - - V
-6 4.5 3.98 - - 3.84 - 3.7 - V
-7.8 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or V
IL
0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
- - ---- - - - V
6 4.5 - - 0.26 - 0.33 - 0.4 V
7.8 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current
I
I
V
CC
or
GND
-6--±0.1 - ±1-±1 µA
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
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