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SNJ54ACT244W

Part # SNJ54ACT244W
Description Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin CFP
Category IC
Availability In Stock
Qty 28
Qty Price
1 - 5 $22.07317
6 - 11 $17.55821
12 - 17 $16.55488
18 - 23 $15.38433
24 + $13.71212
Manufacturer Available Qty
Texas Instruments
Date Code: 0425
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Texas Instruments
Date Code: 0431
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

SN54ACT244, SN74ACT244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS517C – JUNE 1995 – REVISED OCTOBER 2002
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range,
V
CC
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO
T
A
= 25°C SN54ACT244 SN74ACT244
UNIT
PARAMETER
(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
UNIT
t
PLH
A
Y
2 6.5 9 1 10 1.5 10
ns
t
PHL
A
Y
2 7 9 1 10 1.5 10
ns
t
PZH
OE
Y
1.5 7 8.5 1 9.5 1 9.5
ns
t
PZL
OE
Y
2 7 9.5 1 11 1.5 10.5
ns
t
PHZ
OE
Y
2 8 9.5 1 11 1.5 10.5
ns
t
PLZ
OE
Y
2.5 7.5 10 1 11.5 2 10.5
ns
operating characteristics, V
CC
= 5 V, T
A
= 25°C
PARAMETER TEST CONDITIONS TYP UNIT
C
pd
Power dissipation capacitance per buffer/driver C
L
= 50 pF, f = 1 MHz 45 pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
C
L
= 50 pF
(see Note A)
LOAD CIRCUIT
S1
2 × V
CC
500 Ω
500 Ω
t
PLH
t
PHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × V
CC
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
V
OL
V
OH
t
PZL
t
PZH
t
PLZ
t
PHZ
1.5 V1.5 V
1.5 V 1.5 V
≈V
CC
3 V
0 V
50% V
CC
50% V
CC
V
OH
V
OL
0 V
50% V
CC
V
OL
+ 0.3 V
50% V
CC
≈0 V
3 V
Open
Input
Output
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
t
PLH
/t
PHL
t
PLZ
/t
PZL
t
PHZ
/t
PZH
Open
2 × V
CC
Open
TEST S1
V
OH
– 0.3 V
NOTES: A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z
O
= 50 Ω, t
r
≤ 2.5 ns, t
f
≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-8776001M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-8776001MRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
5962-8776001MSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
5962-8776001SRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
5962-8776001SSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
SN74ACT244DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74ACT244DBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244N ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74ACT244NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74ACT244NSR ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244PW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74ACT244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ACT244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54ACT244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54ACT244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54ACT244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ACT244, SN54ACT244-SP, SN74ACT244 :
•
Automotive: SN74ACT244-Q1
•
Enhanced Product: SN74ACT244-EP
NOTE: Qualified Version Definitions:
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
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