OPA131, 2131, 4131
2
SBOS040A
www.ti.com
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR
(1)
RANGE MARKING NUMBER MEDIA, QUANTITY
Single
OPA131 SO-8 D –40°C to +85°C OPA131UJ OPA131UJ Rails, 100
" " " " " OPA131UJ/2K5 Tape and Reel, 2500
OPA131 SO-8 D –40°C to +85°C OPA131UA OPA131UA Rails, 100
" " " " " OPA131UA/2K5 Tape and Reel, 2500
OPA131 SO-8 D –40°C to +85°C OPA131U OPA131U Rails, 100
" " " " " OPA131U/2K5 Tape and Reel, 2500
Dual
OPA2131 SO-8 D –40°C to +85°C OPA2131UJ OPA2131UJ Rails, 100
" " " " " OPA2131UJ/2K5 Tape and Reel, 2500
OPA2131 SO-8 D –40°C to +85°C OPA2131UA OPA2131UA Rails, 100
" " " " " OPA2131UA/2K5 Tape and Reel, 2500
Quad
OPA4131 DIP-14 N –40°C to +85°C OPA4131PJ OPA4131PJ Rails, 25
" " " " OPA4131PA OPA4131PA Rails, 25
OPA4131 SOL-16 DW –40°C to +85°C OPA4131UA OPA4131UA Rails, 48
" " " " " OPA4131UA/1K Tape and Reel, 1000
OPA4131 SOL-14 D –40°C to +85°C OPA4131NJ OPA4131NJ Rails, 58
" " " " OPA4131NA OPA4131NA Rails, 58
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage, V+ to V–.................................................................... 36V
Input Voltage .................................................. (V–) – 0.7V to (V+) + 0.7V
Output Short-Circuit
(2)
.............................................................. Continuous
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature ..................................................... –55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Short-circuit to ground, one amplifier per package.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
