PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-89757013A ACTIVE LCCC FK 28 1 TBD POST-PLATE N / A for Pkg Type
5962-8975701KA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
5962-8975701LA ACTIVE CDIP JT 24 1 TBD A42 SNPB N / A for Pkg Type
SN54AS885JT ACTIVE CDIP JT 24 1 TBD A42 SNPB N / A for Pkg Type
SN74AS885DW ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS885DWE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS885DWG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS885DWR ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS885DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS885DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AS885NT ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AS885NT3 OBSOLETE PDIP NT 24 TBD Call TI Call TI
SN74AS885NTE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SNJ54AS885FK ACTIVE LCCC FK 28 1 TBD POST-PLATE N / A for Pkg Type
SNJ54AS885JT ACTIVE CDIP JT 24 1 TBD A42 SNPB N / A for Pkg Type
SNJ54AS885W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
Addendum-Page 1
