PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-9314801Q2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
5962-9314801QRA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC
5962-9314801QSA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC
SN74ABT377DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74ABT377DW OBSOLETE SOIC DW 20 TBD Call TI Call TI
SN74ABT377DWR OBSOLETE SOIC DW 20 TBD Call TI Call TI
SN74ABT377N OBSOLETE PDIP N 20 TBD Call TI Call TI
SNJ54ABT377FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54ABT377J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC
SNJ54ABT377W ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 1
