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SI4413ADY-T1-E3

Part # SI4413ADY-T1-E3
Description TRANS MOSFET P-CH 30V 10.5A 8SOIC - Tape and Reel
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Vishay Siliconix
Si4413ADY
Document Number: 73792
S-83096-Rev. C, 29-Dec-08
www.vishay.com
1
P-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Available
TrenchFET
®
Power MOSFET
APPLICATIONS
Notebook
- Load Switch
- Battery Switch
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
- 30
0.0075 at V
GS
= - 10 V
- 15
0.011 at V
GS
= - 4.5 V
- 12.3
S
S
D
D
D
S
G
D
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4413ADY-T1-E3 (Lead (Pb)-free)
Si4413ADY-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
G
D
P-Channel MOSFET
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol 10 s Steady State Unit
Drain-Source Voltage
V
DS
- 30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
a
T
A
= 25 °C
I
D
- 15 - 10.5
A
T
A
= 70 °C
- 11.8 - 8.3
Pulsed Drain Current
I
DM
- 50
Continuous Source Current (Diode Conduction)
a
I
S
- 2.7 - 1.36
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
3.0 1.5
W
T
A
= 70 °C
1.9 0.95
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t 10 s
R
thJA
33 42
°C/WSteady State 70 84
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
16 21
www.vishay.com
2
Document Number: 73792
S-83096-Rev. C, 29-Dec-08
Vishay Siliconix
Si4413ADY
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 1.0 - 3.0 V
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 30 V, V
GS
= 0 V
- 1
µA
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 70 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
= - 5 V, V
GS
= - 10 V
- 30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 13 A
0.0063 0.0075
Ω
V
GS
= - 4.5 V, I
D
= - 10 A
0.0083 0.011
Forward Transconductance
a
g
fs
V
DS
= - 15 V, I
D
= - 13 A
50 S
Diode Forward Voltage
a
V
SD
I
S
= - 2.7 A, V
GS
= 0 V
- 0.74 - 1.1 V
Dynamic
b
Total Gate Charge
Q
g
V
DS
= - 15 V, V
GS
= - 5 V, I
D
= - 13 A
61 95
nCGate-Source Charge
Q
gs
15.5
Gate-Drain Charge
Q
gd
32
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 15 Ω
I
D
- 1 A, V
GEN
= - 10 V, R
G
= 6 Ω
21 35
ns
Rise Time
t
r
18 30
Tur n - O f f D e l ay Time
t
d(off)
170 260
Fall Time
t
f
97 150
Gate Resistance
R
g
3.4 Ω
Source-Drain Reverse Recovery Time
t
rr
I
F
= - 2.1 A, dI/dt = 100 A/µs
70 110 ns
Output Characteristics
0
10
20
30
40
5
0
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
= 10 thru 4 V
V
DS
- Drain-to-Source Voltage (V)
)A(
t
n
err
u
C
n
i
ar
D
-
I
D
3 V
2 V
Transfer Characteristics
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
T
C
= 125 °C
- 55 °C
25 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A) I
D
Document Number: 73792
S-83096-Rev. C, 29-Dec-08
www.vishay.com
3
Vishay Siliconix
Si4413ADY
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
On-Resistance vs. Drain Current
Source-Drain Diode Forward Voltage
On-Resistance vs. Junction Temperature
e (Ω)cnatsiseR-nO -R
)no(SD
0 10 20 30 40 50
I
D
- Drain Current (A)
V
GS
= 10 V
V
GS
= 4.5 V
0.004
0.006
0.008
0.010
0.012
0
.
014
0
2
4
6
8
10
0 22446688 110
V
DS
= 15 V
I
D
= 13 A
)V( egatloV ec
ruoS-ot-et
aG
-
Q
g
- Total Gate Charge (nC)
V
GS
0.0 0.2 0.4 0.6 0.8 1.0 1.2
T
J
= 25 °C
100
10
0.1
V
SD
- Source-to-Drain Voltage (V)
) A ( t
n e r r
u C
e c
r
u
o S
-
I
S
T
J
= 150 °C
1
Gate Charge
Capacitance
On-Resistance vs. Gate-to-Source Voltage
0
1400
2800
4200
5600
7
000
0 6 12 18 24 30
V
DS
- Drain-to-Source Voltage (V)
C
rss
C
oss
C
iss
)Fp( ecnaticapaC - C
0.6
0.8
1.0
1.2
1.4
1
.
6
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 10 V
I
D
= 13 A
T
J
- Junction Temperature (°C)
)dezilam
roN(
cen a t s i s e R - n O
-R
)no(SD
02468 10
e (Ω)cn
a
t
s
iseR-n
O
-
R
)no(SD
GS
- Gate-to-Source Voltage (V)
0.000
0.005
0.010
0.015
0.020
0
.
02
5
V
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