MC74VHC244
http://onsemi.com
2
FUNCTION TABLE
INPUTS OUTPUTS
OEA, OEB A, B YA, YB
L L L
L H H
H X Z
ORDERING INFORMATION
Device Package Shipping
†
MC74VHC244DW − OBSOLETE* SOIC−20 WB 38 Units/Rail
MC74VHC244DWR2G SOIC−20 WB
(Pb−Free)
1000/Tape & Reel
MC74VHC244DTG TSSOP−20
(Pb−Free)
75 Units/Rail
MC74VHC244DTR2G TSSOP−20
(Pb−Free)
2500/Tape & Reel
MC74VHC244M − OBSOLETE* SOIC EIAJ−20
(Pb−Free)
1600 Units/Box
MC74VHC244MELG SOIC EIAJ−20
(Pb−Free)
2000/Tape & Reel
*This device is obsolete, information available for reference.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MAXIMUM RATINGS (Note 1)
Symbol
Parameter Value Unit
V
CC
Positive DC Supply Voltage −0.5 to +7.0 V
V
IN
Digital Input Voltage −0.5 to +7.0 V
V
OUT
DC Output Voltage −0.5 to V
CC
+0.5 V
I
IK
Input Diode Current −20 mA
I
OK
Output Diode Current $20 mA
I
OUT
DC Output Current, per Pin $25 mA
I
CC
DC Supply Current, V
CC
and GND Pins $75 mA
P
D
Power Dissipation in Still Air SOIC
TSSOP
500
450
mW
T
STG
Storage Temperature Range −65 to +150 °C
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
>2000
>200
>2000
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 5) $300 mA
q
JA
Thermal Resistance, Junction−to−Ambient SOIC
TSSOP
96
128
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. V
in
and V
out
should be constrained to the range GND v (V
in
or V
out
) v V
CC
. Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either GND or V
CC
). Unused outputs must be left open.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
