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IRFR12N25DPBF

Part # IRFR12N25DPBF
Description MOSFET N-CH 250V 14A DPAK
Category IC
Availability In Stock
Qty 18
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Manufacturer Available Qty
International Rectifier
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

www.irf.com 1
12/2/04
IRFR12N25DPbF
IRFU12N25DPbF
SMPS MOSFET
HEXFET
®
Power MOSFET
V
DSS
R
DS(on)
max I
D
250V 0.26 14A
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 14
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 9.7 A
I
DM
Pulsed Drain Current 56
P
D
@T
C
= 25°C Power Dissipation 144 W
Linear Derating Factor 0.96 W/°C
V
GS
Gate-to-Source Voltage ± 30 V
dv/dt Peak Diode Recovery dv/dt 9.3 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Absolute Maximum Ratings
Notes through are on page 10
D-Pak
IRFR12N25D
I-Pak
IRFU12N25D
l High frequency DC-DC converters
l Lead-Free
Benefits
Applications
l Low Gate-to-Drain Charge to Reduce
Switching Losses
l Fully Characterized Capacitance Including
Effective C
OSS
to Simplify Design, (See
App. Note AN1001)
l Fully Characterized Avalanche Voltage
and Current
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 1.04
R
θJA
Junction-to-Ambient (PCB mount)* –– 50 °C/W
R
θJA
Junction-to-Ambient ––– 110
Thermal Resistance
PD - 95353A
2 www.irf.com
IRFR/U12N25DPbF
Parameter Min. Typ. Max. Units Conditions
g
fs
Forward Transconductance 6.8 ––– ––– S V
DS
= 25V, I
D
= 8.4A
Q
g
Total Gate Charge ––– 23 35 I
D
= 8.4A
Q
gs
Gate-to-Source Charge ––– 5.8 8.7 nC V
DS
= 200V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 12 19 V
GS
= 10V,
t
d(on)
Turn-On Delay Time ––– 9.1 ––– V
DD
= 125V
t
r
Rise Time ––– 25 ––– I
D
= 8.4A
t
d(off)
Turn-Off Delay Time ––– 16 ––– R
G
= 6.8
t
f
Fall Time ––– 9.2 ––– V
GS
= 10V
C
iss
Input Capacitance ––– 810 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 130 ––– V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 22 ––– pF ƒ = 1.0MHz
C
oss
Output Capacitance ––– 1100 ––– V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 50 ––– V
GS
= 0V, V
DS
= 200V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 130 ––– V
GS
= 0V, V
DS
= 0V to 200V
Dynamic @ T
J
= 25°C (unless otherwise specified)
ns
Parameter Typ. Max. Units
E
AS
Single Pulse Avalanche Energy ––– 250 mJ
I
AR
Avalanche Current ––– 8.4 A
E
AR
Repetitive Avalanche Energy ––– 14 mJ
Avalanche Characteristics
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.5 V T
J
= 25°C, I
S
= 8.4A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 140 ––– ns T
J
= 25°C, I
F
= 8.4A
Q
rr
Reverse RecoveryCharge ––– 710 ––– nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Diode Characteristics
14
56
A
Static @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 250 –– –– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient
––– 0.29 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 0.26 V
GS
= 10V, I
D
= 8.4A
V
GS(th)
Gate Threshold Voltage 3.0 ––– 5.0 V V
DS
= V
GS
, I
D
= 250µA
––– ––– 25
µA
V
DS
= 200V, V
GS
= 0V
––– ––– 250 V
DS
= 160V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 30V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -30V
I
GSS
I
DSS
Drain-to-Source Leakage Current
www.irf.com 3
IRFR/U12N25DPbF
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
10
100
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
5.0V
20µs PULSE WIDTH
Tj = 25°C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.1
1
10
100
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
5.0V
20µs PULSE WIDTH
Tj = 175°C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
5.0 7.0 9.0 11.0 13.0 15.0
V
GS
, Gate-to-Source Voltage (V)
0.01
0.10
1.00
10.00
100.00
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
Α
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 15V
20µs PULSE WIDTH
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
14A
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