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IRFP3710

Part # IRFP3710
Description Trans MOSFET N-CH 100V 57A 3-Pin(3+Tab) TO-247AC - Rail/Tu
Category IC
Availability In Stock
Qty 24
Qty Price
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6 - 10 $2.18983
11 - 15 $2.06469
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21 + $1.71015
Manufacturer Available Qty
International Rectifier
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

IRFP3710
HEXFET
®
Power MOSFET
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The TO-247 package is preferred for commercial-
industrial applications where higher power levels
preclude the use of TO-220 devices. The TO-247 is
similar but superior to the earlier TO-218 package
because of its isolated mounting hole.
S
D
G
V
DSS
= 100V
R
DS(on)
= 0.025W
I
D
= 57A
l Advanced Process Technology
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
Description
TO-247AC
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 57
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 40 A
I
DM
Pulsed Drain Current  180
P
D
@T
C
= 25°C Power Dissipation 200 W
Linear Derating Factor 1.3 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 530 mJ
I
AR
Avalanche Current 28 A
E
AR
Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt  5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)
Absolute Maximum Ratings
Parameter Typ. Max. Units
R
qJC
Junction-to-Case ––– 0.75
R
qCS
Case-to-Sink, Flat, Greased Surface 0.24 ––– °C/W
R
qJA
Junction-to-Ambient ––– 40
Thermal Resistance
www.irf.com 1
PD-91490C
IRFP3710
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 100 ––– ––– V V
GS
= 0V, I
D
= 250µA
DV
(BR)DSS
/DT
J
Breakdown Voltage Temp. Coefficient ––– 0.12 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 0.025 W V
GS
= 10V, I
D
= 28A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 20 ––– ––– S V
DS
= 25V, I
D
= 28A
––– ––– 25
µA
V
DS
= 100V, V
GS
= 0V
––– ––– 250 V
DS
= 80V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -20V
Q
g
Total Gate Charge ––– ––– 190 I
D
= 28A
Q
gs
Gate-to-Source Charge ––– ––– 26 nC V
DS
= 80V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 82 V
GS
= 1.7V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time ––– 14 ––– V
DD
= 50V
t
r
Rise Time ––– 59 ––– I
D
= 28A
t
d(off)
Turn-Off Delay Time ––– 58 ––– R
G
= 2.5W
t
f
Fall Time ––– 48 ––– R
D
= 1.7W, See Fig. 10 
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 3000 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 640 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 330 ––– ƒ = 1.0MHz, See Fig. 5
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
S
D
G
I
GSS
ns
5.0
I
DSS
Drain-to-Source Leakage Current
13
Starting T
J
= 25°C, L = 1.4mH
R
G
= 25W, I
AS
= 28A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Notes:
I
SD
£ 28A, di/dt £ 460A/µs, V
DD
£ V
(BR)DSS
,
T
J
£ 175°C
Pulse width £ 300µs; duty cycle £ 2%.
Uses IRF3710 data and test conditions
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) 
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 28A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 210 320 ns T
J
= 25°C, I
F
= 28A
Q
rr
Reverse RecoveryCharge ––– 1.7 2.6 µC di/dt = 100A/µs

Source-Drain Ratings and Characteristics
S
D
G
A
57
180
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
IRFP3710
www.irf.com 3
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
1
10
100
1000
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Volta
g
e (V)
DS
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
20µs PULSE WIDTH
T = 25°C
C
A
4.5V
1
10
100
1000
0.1 1 10 100
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Volta
g
e (V)
DS
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
A
4.5V
20µs PULSE WIDTH
T = 175°C
C
1
10
100
1000
45678910
T = 25°C
J
GS
V , Gate-to-Source Volta
g
e
(
V
)
D
I , Drain-to-Source Current (A)
V = 50V
20µs PULSE WIDTH
DS
A
T = 17C
J
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
V = 10V
GS
A
I = 46A
D
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