Rev. 1.4 35
C8051F320/1
Figure 4.3. LQFP-32 Recommended PCB Land Pattern
Table 4.3. LQFP-32 PCB Land Pattern Dimensions
Dimension Min Max Dimension Min Max
C1 8.40 8.50 X1 0.40 0.50
C2 8.40 8.50 Y1 1.25 1.35
E 0.80
Notes:
General
1. Al
l dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
3. Al
l metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
mask and the metal pad is to be 60m minimum, all the way around the pad.
Stencil Design
4. A st
ainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
to assure good solder paste release.
5. The stencil thic
kness should be 0.125mm (5 mils).
6. T
he ratio of stencil aperture to land pad size should be 1:1 for all pads.
Card Assembly
7. A No-Cl
ean, Type-3 solder paste is recommended.
8. T
he recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
Body Components.
