AD8605/AD8606/AD8608
Rev. D | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3.
Parameter Rating
Supply Voltage 6 V
Input Voltage GND to V
S
Differential Input Voltage 6 V
Output Short-Circuit Duration
to GND
Observe Derating Curves
Storage Temperature Range
All Packages −65°C to +150°C
Operating Temperature Range
AD8605/AD8606/AD8608 −40°C to +125°C
Junction Temperature Range
All Packages −65°C to +150°C
Lead Temperature Range
(Soldering, 60 sec)
300°C
Table 4. Package Type
Package Type θ
JA
1
θ
JC
Unit
5-Bump MicroCSP (CB) 220 220 °C/W
5-Lead SOT-23 (RT) 230 92 °C/W
8-Lead MSOP (RM) 210 45 °C/W
8-Lead SOIC (R) 158 43 °C/W
14-Lead SOIC (R) 120 36 °C/W
14-Lead TSSOP (RU) 180 35 °C/W
1
θ
JA
is specified for worst-case conditions, i.e., θ
JA
is specified for device in
socket for PDIP packages; θ
JA
is specified for device soldered onto a circuit
board for surface-mount packages.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
