ADG408/ADG409
REV. A
–4–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
Analog, Digital Inputs
2
. . . . . V
SS
–2 V to V
DD
+2 V or 20 mA,
Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155°C/W
θ
JC
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50°C/W
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at A, EN, S or D will be clamped by internal diodes. Current should
be limited to the maximum ratings given.
ORDERING INFORMATION
Model
1
Temperature Range Package Option
2
ADG408BN –40°C to +85°C N-16
ADG408BR –40°C to +85°C R-16A
ADG408BRU –40°C to +85°C RU-16
ADG408TQ –55°C to +125°C Q-16
ADG409BN –40°C to +85°C N-16
ADG409BR –40°C to +85°C R-16A
ADG409TQ –55°C to +125°C Q-16
NOTES
1
To order MIL-STD-883, Class B processed parts, add /883B to T grade part
numbers.
2
N = Plastic DIP; Q = Cerdip; R = 0.15" Small Outline IC (SOIC);
RU = Think Shrink Small Outline Package (TSSOP).
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
