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ADF4193BCPZ

Part # ADF4193BCPZ
Description PLL FREQ SYNTHESIZER SGL 32LFCSP EP - Trays
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Low Phase Noise, Fast Settling PLL
Frequency Synthesizer
ADF4193
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
FEATURES
New, fast settling, fractional-N PLL architecture
Single PLL replaces ping-pong synthesizers
Frequency hop across GSM band in 5 μs with phase settled
by 20 μs
0.5° rms phase error at 2 GHz RF output
Digitally programmable output phase
RF input range up to 3.5 GHz
3-wire serial interface
On-chip, low noise differential amplifier
Phase noise figure of merit: −216 dBc/Hz
Loop filter design possible using ADI SimPLL
APPLICATIONS
GSM/EDGE base stations
PHS base stations
Instrumentation and test equipment
GENERAL DESCRIPTION
The ADF4193 frequency synthesizer can be used to implement
local oscillators in the upconversion and downconversion
sections of wireless receivers and transmitters. Its architecture
is specifically designed to meet the GSM/EDGE lock time
requirements for base stations. It consists of a low noise, digital
phase frequency detector (PFD), and a precision differential
charge pump. There is also a differential amplifier to convert
the differential charge pump output to a single-ended voltage
for the external voltage-controlled oscillator (VCO).
The Σ-Δ based fractional interpolator, working with the N
divider, allows programmable modulus fractional-N division.
Additionally, the 4-bit reference (R) counter and on-chip
frequency doubler allow selectable reference signal (REFIN)
frequencies at the PFD input. A complete phase-locked loop
(PLL) can be implemented if the synthesizer is used with an
external loop filter and a VCO. The switching architecture
ensures that the PLL settles inside the GSM time slot guard
period, removing the need for a second PLL and associated
isolation switches. This decreases cost, complexity, PCB area,
shielding, and characterization on previous ping-pong GSM
PLL architectures.
FUNCTIONAL BLOCK DIAGRAM
05328-001
N COUNTER
SW1
CP
OUT+
CP
OUT–
SW2
REFERENCE
DATA
LE
24-BIT
DATA
REGISTER
CLK
REF
IN
A
GND
1 A
GND
2 D
GND
1 D
GND
2 D
GND
3 SD
GND
SW
GND
V
DD
DGND
LOCK DETECT
R
DIV
N
DIV
SDV
DD
DV
DD
1 DV
DD
2 DV
DD
3
A
V
DD
1
V
P
1
V
P
2
V
P
3R
SET
OUTPUT
MUX
MUX
OUT
+
HIGH Z
PHASE
FREQUENCY
DETECTOR
ADF4193
FRACTIONAL
INTERPOLATOR
MODULUS
REG
FRACTION
REG
INTEGER
REG
RF
IN+
RF
IN–
×2
DOUBLER
4-BIT R
COUNTER
/2
DIVIDER
CHARGE
PUMP
+
+
DIFFERENTIAL
AMPLIFIER
CMR
AIN–
AIN+
A
OUT
SW3
Figure 1.
ADF4193
Rev. B | Page 2 of 28
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Characteristics ................................................................ 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 11
Reference Input Section............................................................. 11
RF Input Stage............................................................................. 11
Register Map.................................................................................... 14
FRAC/INT Register (R0)........................................................... 15
MOD/R Register (R1)................................................................ 16
Phase Register (R2) .................................................................... 17
Function Register (R3) .............................................................. 18
Charge Pump Register (R4) ...................................................... 19
Power-Down Register (R5)....................................................... 20
Mux Register (R6) ...................................................................... 21
Programming .................................................................................. 22
Worked Example ........................................................................ 22
Spur Mechanisms ....................................................................... 22
Power-Up Initialization ............................................................. 23
Changing the Frequency of the PLL and the Phase Look-Up
Table ............................................................................................. 23
Applications..................................................................................... 25
Local Oscillator for A GSM Base Station................................ 25
Interfacing ................................................................................... 27
PCB Design Guidelines for Chip Scale Package .................... 27
Outline Dimensions ....................................................................... 28
Ordering Guide .......................................................................... 28
REVISION HISTORY
6/06—Rev A. to Rev. B
Changes to Table 1............................................................................ 3
Changes to Figure 32...................................................................... 18
Changes to Power-Up Initialization Section............................... 23
Changes to Timer Values for Tx Section and Timer Values for
Rx Section........................................................................................ 25
11/05—Rev 0. to Rev. A
Updated Format..................................................................Universal
Changes to Features Section............................................................ 1
Changes to Table 1............................................................................ 3
Changes to Reference Input Section ............................................ 11
Changes to RF N Divider Section ................................................ 11
Changes to the Lock Detect Section ............................................ 13
Changes to Figure 29...................................................................... 15
Changes to the 8-Bit INT Value Section ..................................... 15
Changes to Figure 33...................................................................... 19
Replaced Figure 35 ......................................................................... 21
Changes to the Σ-Δ and Lock Detect Modes Section................ 21
Changes to the Power-Up Initialization Section........................ 23
Changes to Table 8.......................................................................... 23
Changes to the Local Oscillator for a GSM
Base Station Section ....................................................................... 25
Changes to the Timer Values for Rx Section .............................. 25
Changes to Figure 36...................................................................... 26
Updates to the Outline Dimensions ............................................ 28
Changes to the Ordering Guide ................................................... 28
4/05—Revision 0: Initial Version
ADF4193
Rev. B | Page 3 of 28
SPECIFICATIONS
AV
DD
= DV
DD
= SDV
DD
= 3 V ± 10%, V
P
1, V
P
2 = 5 V ± 10%, V
P
3 = 5.35 V ± 5%, AGND = DGND = GND = 0 V, R
SET
= 2.4 kΩ, dBm
referred to 50 Ω, T
A
= T
MIN
to T
MAX
, unless otherwise noted.
Table 1.
Parameter B Version
1
Unit Test Conditions/Comments
RF CHARACTERISTICS
RF Input Frequency (RF
IN
) 0.4/3.5 GHz min/max See Figure 21 for input circuit
RF Input Sensitivity –10/0 dBm min/max
Maximum Allowable Prescaler Output Frequency
2
470 MHz max
REF
IN
CHARACTERISTICS
REF
IN
Input Frequency 300 MHz max For f > 120 MHz, set REF/2 bit = 1
REF
IN
Edge Slew Rate 300 V/μs min
REF
IN
Input Sensitivity 0.7/V
DD
V p-p min/max AC-coupled
0 to V
DD
V max CMOS-compatible
REF
IN
Input Capacitance 10 pF max
REF
IN
Input Current ±100 μA max
PHASE DETECTOR
Phase Detector Frequency 26 MHz max
CHARGE PUMP
I
CP
Up/Down
High Value 6.6 mA typ With R
SET
= 2.4 kΩ
Low Value 104 μA typ With R
SET
= 2.4 kΩ
Absolute Accuracy 5 % typ
R
SET
Range 1/4 kΩ min/max Nominally R
SET
= 2.4 kΩ
I
CP
Three-State Leakage 1 nA typ
I
CP
Up vs. Down Matching 0.1 % typ 0.75 V ≤ V
CP
V
P
– 1.5 V
I
CP
vs. V
CP
1 % typ 0.75 V ≤ V
CP
V
P
– 1.5 V
I
CP
vs. Temperature 1 % typ 0.75 V ≤ V
CP
V
P
– 1.5 V
DIFFERENTIAL AMPLIFIER
Input Current 1 nA typ
Output Voltage Range 1.4/(V
P
3 − 0.3) V min/max
VCO Tuning Range 1.8/(V
P
3 − 0.8) V min/max
Output Noise 7 nV/√Hz typ @ 20 kHz offset
LOGIC INPUTS
V
IH
, Input High Voltage 1.4 V min
V
IL
, Input Low Voltage 0.7 V max
I
INH
, I
INL
, Input Current ±1 μA max
C
IN
, Input Capacitance 10 pF max
LOGIC OUTPUTS
V
OH
, Output High Voltage V
DD
– 0.4 V min I
OH
= 500 μA
V
OL
, Output Low Voltage 0.4 V max I
OL
= 500 μA
POWER SUPPLIES
AV
DD
2.7/3.3 V min/V max
DV
DD
AV
DD
V
P
1, V
P
2 4.5/5.5 V min/V max AV
DD
V
P
1, V
P
2 ≤ 5.5 V
V
P
3 5.0/5.65 V min/V max V
P
1, V
P
2 ≤ V
P
3 ≤ 5.65 V
I
DD
(AV
DD
+ DV
DD
+ SDV
DD
) 27 mA max 22 mA typ
I
DD
(V
P
1 + V
P
2) 27 mA max 22 mA typ
I
DD
(V
P
3) 30 mA max 24 mA typ
I
DD
Power-Down 10 μA typ
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