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Material Content Data Sheet
Sales Product Name BTS3800SL Issued 29. August 2013
MA# MA000877334
Package PG-SCT595-5-1 Weight* 13.92 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip inorganic material silicon 7440-21-3 0.331 2.38 2.38 23804 23804
leadframe inorganic material silicon 7440-21-3 0.001 0.01 87
non noble metal titanium 7440-32-6 0.006 0.04 434
non noble metal chromium 7440-47-3 0.018 0.13 1303
non noble metal copper 7440-50-8 6.019 43.25 43.43 432562 434386
wire noble metal gold 7440-57-5 0.024 0.18 0.18 1756 1756
encapsulation organic material carbon black 1333-86-4 0.055 0.39 3924
plastics brominated resin - 0.068 0.49 4905
inorganic material antimonytrioxide 1309-64-4 0.136 0.98 9809
plastics epoxy resin - 1.242 8.93 89266
inorganic material silicondioxide 60676-86-0 5.323 38.26 49.05 382569 490473
leadfinish non noble metal tin 7440-31-5 0.335 2.41 2.41 24106 24106
plating noble metal silver 7440-22-4 0.142 1.02 1.02 10170 10170
glue plastics epoxy resin - 0.037 0.27 2678
noble metal silver 7440-22-4 0.176 1.26 1.53 12627 15305
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com
