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3925-0

Part # 3925-0
Description CLIP MINIGRABBER D-I-Y BLK
Category HARDWARE
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Qty 13
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ITT POMONA ELECTRONICS
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

1
TO-220AB
Item Symbol Ratings Unit Remarks
Drain-source voltage VDS 250
VDSX 220
Continuous Drain Current ID 34
Pulsed Drain Current ID(puls] ±136
Gate-Source Voltage VGS ±30
Maximum Avalanche current IAR 34
Non-Repetitive EAS 665.7
Maximum Avalanche Energy
Repetitive EAR 27
Maximum Avalanche Energy
Maximum Drain-Source dV/dt dVDS/dt 20
Peak Diode Recovery dV/dt dV/dt 5
Peak Diode Recovery -di/dt -di/dt 100
Max. Power Dissipation PD 270
2.02
Operating and Storage Tch +150
Temperature range Tstg
Electrical characteristics (Tc =25°C unless otherwise specified)
Thermalcharacteristics
2SK3925-01
FUJI POWER MOSFET
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C unless otherwise specified)
Item Symbol Test Conditions
Zero Gate Voltage Drain Current IDSS
VDS=250V VGS=0V
VDS=200V VGS=0V
VGS=±30V
ID=17A VGS=10V
ID=17A VDS=25V
VCC=48V ID=17A
VGS=10V
RGS=10
Min. Typ. Max. Units
V
V
µA
mA
nA
m
S
pF
nC
V
ns
µC
ns
Min. Typ. Max. Units
Thermal resistance
Rth(ch-c) channel to case
Rth(ch-a) channel to ambient
0.463
62
°C/W
°C/W
Symbol
BVDSS
VGS(th)
IGSS
RDS(on)
gfs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
QG
QGS
QGD
VSD
trr
Qrr
Item
Drain-Source Breakdown Voltaget
Gate Threshold Voltage
Gate-Source Leakage Current
Drain-Source On-State Resistance
Forward Transcondutance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Time ton
Turn-Off Time toff
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
Test Conditions
ID= 250
µ
A VGS=0V
ID= 250
µ
A VDS=VGS
Tch=25°C
Tch=125°C
VDS=0V
VDS=75V
VGS=0V
f=1MH
VCC=125V
ID=34A
VGS=10V
IF=34A VGS=0V Tch=25°C
IF=34A VGS=0V
-di/dt=100A/µs
Tch=25°C
V
V
A
A
V
A
mJ
mJ
kV/µs
kV/µs
A/µs
W
°C
°C
250
3.0 5.0
25
2.0
100
85 110
13 26
1850 2800
220 330
21 32
20 30
19 29
56 85
19 29
56 85
20 30
19 29
1.00 1.50
140 250
0.5 1.25
-55 to +150
Outline Drawings (mm)
www.fujielectric.co.jp/fdt/scd
Super FAP-G Series
N-CHANNEL SILICON POWER MOSFET
Equivalent circuit schematic
200406
VGS=-30V
Note *1
Note *2
Note *3
VDS 250V
Note *4
Note *5
Tc=25°C
Ta=25°C
=
<
Features
High speed switching Low on-resistance
No secondary breadown Low driving power
Avalanche-proof
Applications
Switching regulators DC-DC converters
UPS (Uninterruptible Power Supply)
Gate(G)
Source(S)
Drain(D)
=
<
Note *1:Tch 150°C,Repetitive and Non-repetitive
Note *2:StartingTch=25°C,IAS=14A,L=5.71mH,
VCC=48V,RG=50
EAS limited by maximum channel temperature
and avalanch current.
See to the ‘Avalanche Energy’ graph
Note *3:Repetitive rating:Pulse width limited by
maximum channel temperature.
See to the ‘Transient Theemal impedance’
graph
Note *4:I
F -ID, -di/dt=100A/µs,VCC BVDSS,Tch 150°C
Note *5:I
F -ID, dv/dt=5kV/µs,VCC BVDSS,Tch 150°C
=
<
=
<
=
<
=
<
=
<
=
<
2
Characteristics
2SK3925-01
FUJI POWER MOSFET
0 25 50 75 100 125 150
0
50
100
150
200
250
300
Allowable Power Dissipation
PD=f(Tc)
PD [W]
Tc [
°
C]
0246810121416
0
10
20
30
40
50
60
70
80
90
100
20V
10V
7.5V
7V
6.5V
ID [A]
VDS [V]
Typical Output Characteristics
ID=f(VDS):80
µ
s pulse test,Tch=25
°
C
VGS=6V
012345678910
0.01
0.1
1
10
100
ID[A]
VGS[V]
Typical Transfer Characteristic
ID=f(VGS):80
µ
s pulse test,VDS=25V,Tch=25
°
C
0.1 1 10 100
0.1
1
10
100
gfs [S]
ID [A]
Typical Transconductance
gfs=f(ID):80
µ
s pulse test,VDS=25V,Tch=25
°
C
0 102030405060708090
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
RDS(on) [
]
ID [A]
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80
µ
s pulse test,Tch=25
°
C
10V
20V
8V
7.5V
7.0V
VGS=6.5V
-50 -25 0 25 50 75 100 125 150
0.00
0.05
0.10
0.15
0.20
0.25
0.30
RDS(on) [
]
Tch [
°
C]
typ.
max.
Drain-Source On-state Resistance
RDS(on)=f(Tch):ID=17A,VGS=10V
3
2SK3925-01
FUJI POWER MOSFET
-50-250 255075100125150
0
1
2
3
4
5
6
7
max.
min.
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch):VDS=VGS,ID=250uA
VGS(th) [V]
Tch [
°
C]
0 20406080100120140
0
4
8
12
16
20
24
Qg [nC]
Typical Gate Charge Characteristics
VGS=f(Qg):ID=34A,Tch=25
°
C
VGS [V]
200V
250V
Vcc= 50V
10
-1
10
0
10
1
10
2
10
3
10p
100p
1n
10n
C [F]
VDS [V]
Typical Capacitance
C=f(VDS):VGS=0V,f=1MHz
Crss
Coss
Ciss
0.00 0.25 0.50 0.75 1.00 1.25 1.50
0.1
1
10
100
IF [A]
VSD [V]
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80
µ
s pulse test,Tch=25
°
C
10
-1
10
0
10
1
10
2
10
0
10
1
10
2
10
3
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=48V,VGS=10V,RG=10
td(on)
tr
tf
td(off)
t [ns]
ID [A]
0 25 50 75 100 125 150
0
100
200
300
400
500
600
700
I
AS
=14A
I
AS
=21A
I
AS
=34A
EAV [mJ]
starting Tch [
°
C]
Maximum Avalanche Energy vs. starting Tch
E(AV)=f(starting Tch):Vcc=48V,I(AV)<=34A
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