SC105.....5. Series
2
Bulletin I0503J 12/99
www.irf.com
SC105xxxxx5B Inked Probed Unsawn Wafer (Wafer in Box) 1150
SC105xxxxx5R Probed Die in Tape & Reel 3000
SC105xxxxx5
P Probed Die in Waffle Pack 1150
SC105xxxxx5
F Inked Probed Sawn Wafer on Film 1150
Device T
J
Max. V
R
Typ. I
R
@ 25°C Typ. I
R
@ 125°C Max. V
F
@ I
F
Package
# (°C) (V) (µA) (mA) (V) Style
SC105R015x5x 125 15 3000 n.a. contact factory
SC105S020x5x 125 20 n.a. contact factory
SC105
S030x5x 150 30 220 100 0.49 @ 15A TO-220
SC105
S045x5x 150 45 150 75 0.54 @ 15A TO-247
SC105S060x5x 150 60 110 60 0.60 @ 15A TO-247
SC105
H045x5x 175 45 35 10 0.62 @ 15A TO-220
SC105H100x5x 175 100 12 7 0.86 @ 15A TO-247
SC105
H150x5x 175 150 15 7 1.00 @ 15A TO-220
Electrical Characteristics
Device Metal Thickness Metal Thickness
# Front Metal Back Metal
SC105xxxx
A5x Bondable -- Al/Si 30 kÅ -- Cr 1 kÅ Ni 4 kÅ Ag 6 kÅ
SC105xxxx
S5x Solderable Ti 2 kÅ Ni 6 kÅ Ag 35 kÅ Cr 1 kÅ Ni 4 kÅ Ag 6 kÅ
Mechanical Data
Device Description Minimum Order Quantity
# Wafer in Sale Package
Packaging
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
