040614
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3.45
1.78
1.78
3.15
Dimensions (mm)
Solder pad Layout (mm)
Dimensions (mm)
SMD1812P010TS/TF 0.10 0.30 30 10 1.50 @ 0.50 0.8 1.600 7.000 15.000 • •
SMD1812P014TS/TF 0.14 0.34 60 10 0.15 @ 1.50 0.8 1.500 4.000 6.000 • •
SMD1812P020TS/TF 0.20 0.40 30 10 0.02 @ 8.00 0.8 0.800 2.900 5.000 • •
SMD1812P050TS/TF 0.50 1.00 15 40 0.15 @ 8.00 0.8 0.150 0.600 1.000 • •
SMD1812P075TS/TF 0.75 1.50 13.2 40 0.20 @ 8.00 0.8 0.110 0.260 0.450 • •
SMD1812P075TS/TF/24 0.75 1.50 24 40 0.20 @ 8.00 0.8 0.110 0.200 0.290 • •
SMD1812P110TS/TF 1.10 2.20 6 40 0.30 @ 8.00 0.8 0.040 0.120 0.210 • •
SMD1812P110TS/TF/15* 1.10 1.95 15 40 0.50 @ 8.00 0.8 0.060 0.120 0.180 • •
SMD1812P110TS/TF/16 1.10 1.95 16 40 0.50 @ 8.00 0.8 0.060 0.120 0.180 • •
SMD1812P125TS/TF 1.25 2.50 15 40 0.40 @ 8.00 0.8 0.070 0.160 0.250 • •
SMD1812P150TS/TF 1.50 3.00 6 40 0.50 @ 8.00 0.8 0.040 0.070 0.110 • •
SMD1812P160TS/TF 1.60 2.80 6 40 1.00 @ 8.00 0.8 0.030 0.066 0.100 • •
SMD1812P160TS/TF/8 1.60 2.80 8 40 1.00 @ 8.00 0.8 0.030 0.066 0.100 • •
SMD1812P200TS/TF 2.00 3.50 8 40 2.00 @ 8.00 0.8 0.020 0.040 0.060 • •
SMD1812P260TS/TF 2.60 5.20 6 40 2.50 @ 8.00 0.8 0.015 0.030 0.047 • •
cURus
TÜV
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
NOTE:
I
hold
= Hold current: maximum current device will pass without tripping in 20 °C still air.
I
trip
=
Trip current: minimum current at which the device will trip in 20 °C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 20 °C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specifi ed rating may result in damage and possible arcing and fl ame.
Specifi cations are subject to change without notice
* obsolete
Model I
hold
I
Trip
V
max. dc
I
max.
max. time to trip P
d max.
Resistance Approvals
(A) (A) (A) (V) (A) (s @ A)
(W)
R
min.
(Ω)
R
typ.
(Ω)
R
I max.
(Ω)
Order Qty. Order- Model Packaging
Information Number
Model A B C D E packaging quantity
Min Max Min Max Min Max Min Min Max tape
SMD1812P010TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P014TS/TF 4.37 4.73 3.07 3.41 0.75 1.95 0.30 0.25 0.65
SMD1812P020TS/TF 4.37 4.73 3.07 3.41 0.55 1.00 0.30 0.25 0.65
SMD1812P050TS/TF 4.37 4.73 3.07 3.41 0.50 0.75 0.30 0.25 0.50
SMD1812P075TS/TF 4.37 4.73 3.07 3.41 0.50 0.75 0.30 0.25 0.50
SMD1812P075TS/TF/24 4.374.73 3.07 3.41 0.75 1.55 0.30 0.25 0.65
SMD1812P110TS/TF 4.37 4.73 3.07 3.41 0.50 0.75 0.30 0.25 0.50
SMD1812P110TS/TF/15 4.374.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P110TS/TF/16 4.374.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P125TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.50
SMD1812P150TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.50
SMD1812P160TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P160TS/TF/8 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P200TS/TF 4.37 4.73 3.07 3.41 0.75 1.55 0.30 0.25 0.50
SMD1812P260TS/TF 4.37 4.73 3.07 3.41 1.00 1.60 0.30 0.25 0.50
1,500
1,500
2,000
2,000
2,000
1,500
2,000
1,500
1,500
1,500
1,500
1,500
1,500
1,500
1,000
POLYFUSE
®
RESETTABLE FUSES
Specifi cations
Packaging
A Blistertape and reel Ø 178 mm
Materials
Terminals: Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Lead free plating on request
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specifi cation RS186-9E,
ANSI/J-STD-002, Category 3
Refl ow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
SMD Type, 6 V - 60 V
Standard
UL 1434 1
st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TÜV
Features
This product line is also designed for surface-
mount applications. The products with 1812-mil
footprint range in hold currents from 0.1 A to
2.6 A and voltage from 6 V to 60 V. These devices
are suited for PC mother board, computer periph-
eral products and general electronics applications.
Suitable for refl ow soldering.
WebLinks
Further info see:
www.wickmanngroup.com
Further application info see fuseology:
www.wickmanngroup.com/download/fuseology.pdf
SMD1812
formerly No. 729
Please choose TS for SnPb and TF for Sn plating
