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263-2DB

Part # 263-2DB
Description DC-18.0GHZ
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Page 1 of 4
Document No. 70-0226-01 www.psemi.com ©2007 Peregrine Semiconductor Corp. All rights reserved.
Contact sales@psemi.com for full version of datasheet
The PE42632 is a HaRP™-enhanced SP6T
RF Switch developed on the UltraCMOS™
process technology. This 50 switch
addresses the specific design needs of the
Quad-Band GSM Handset Antenna Switch
Module Market. On-chip CMOS decode logic
facilitates three-pin low voltage CMOS control.
High ESD tolerance of 1500 V at all ports, no
blocking capacitor requirements and on-chip
SAW filter over-voltage protection devices
make this the ultimate in integration and
ruggedness.
Peregrine’s HaRP™ technology
enhancements deliver high linearity and
exceptional harmonics performance. It is an
innovative feature of the UltraCMOS™
process, providing performance superior to
GaAs with the economy and integration of
conventional CMOS.
Product Brief
SP6T UltraCMOS™ 2.70 V Switch
100 – 3000 MHz, 50
Product Description
Figure 1. Functional Diagram
PE42632 Flip Chip
Features
Three pin CMOS logic control with
integral decoder/driver
Low TX insertion loss: 0.55 dB at
900 MHz, 0.60 dB at 1900 MHz
TX – RX Isolation of 38 dB at 900 MHz,
31 dB at 1900 MHz
Low harmonics: 2f
o
= -90 dBc and
3f
o
= -82 dBc
1500 V HBM ESD tolerance all ports
41 dBm P1dB, TX paths
No blocking capacitors required
RoHS compliant lead-free solder balls
Figure 2. Die Top View
RX1
RX2
RX3RX4
TX1
TX2
V2
V3
V1
CMOS
Control/
Driver
and ESD
8 7
5
6
11
13
2
14
10 3
9
4
1
12
15
16
TX1
GND
TX2
RX1
V
DD
V1
V2
V3
GND
RX4 RX3 RX2
GND
GND
GND ANT
PE4263 2 Die
Figure 3. Package Type: Flip Chip
Product Brief
PE42632
Page 2 of 4
©2007 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0226-01 UltraCMOS™ RFIC Solutions
Contact sales@psemi.com for full version of datasheet
Table 2. Operating Ranges Table 3. Absolute Maximum Ratings
Part performance is not guaranteed under these
conditions. Exposure to absolute maximum conditions
for extended periods of time may adversely affect
reliability. Stresses in excess of absolute maximum
ratings may cause permanent damage.
Table 1. Electrical Specifications @ +25 °C, V
DD
= 2.5 - 2.8 V (Z
S
= Z
L
= 50 )
Parameter Conditions Typical Units
Operational Frequency 100-3000 MHz
Insertion Loss
1
ANT - TX - 850 / 900 MHz
ANT - TX - 1800 / 1900 MHz
ANT - RX - 850 / 900 MHz
ANT - RX - 1800 / 1900 MHz
0.55
0.6
0.9
1.15
dB
dB
dB
dB
Isolation
TX - RX - 850 / 900 MHz
TX - RX - 1800 / 1900 MHz
TX - TX - 850 / 900 MHz
TX - TX - 1800 / 1900 MHz
38
31
31
26
dB
dB
dB
dB
Return Loss
850 / 900 MHz
1800 / 1900 MHz
23
22
dB
2nd Harmonic
2,3
35 dBm TX Input - 850 / 900 MHz
33 dBm TX Input - 1800 / 1900 MHz
-90
-89
dBc
3rd Harmonic
2,3
35 dBm TX Input - 850 / 900 MHz
33 dBm TX Input - 1800 / 1900 MHz
-82
-80
dBc
Switching Time
4
50% Control Logic to 90% RF 1 µs
Notes: 1. Insertion loss specified with optimal ANT impedance matching.
2. Measured in Pulsed Wave Mode.
3. Assumes RF input duty cycle of 50% and 4620 µs, measured per 3GPP TS 45.005
4. Power on any port must not exceed +20 dBm during switching event.
Note: 5. Assumes RF input period of 4620 µs and duty cycle of 50%.
Parameter Symbol Min Typ Max Units
Temperature range T
OP
-40 +85 °C
V
DD
Supply Voltage V
DD
2.5 2.70 2.8 V
I
DD
Power Supply Current
(V
DD
= 2.75 V)
I
DD
13 20 µA
TX input power
5
(VSWR 3:1)
824-915 MHz
+35
dBm
TX input power
5
(VSWR 3:1)
1710-1910 MHz
+33
RX input power
5
(VSWR =1:1) P
IN
+20 dBm
Control Voltage High V
IH
0.7 x
V
DD
V
Control Voltage Low V
IL
0.3 x
V
DD
V
P
IN
Symbol Parameter/Conditions Min Max Units
V
DD
Power supply voltage -0.3 4.0 V
V
I
Voltage on any DC input -0.3
V
DD
+
0.3
V
T
ST
Storage temperature range -65 +150 °C
T
OP
Operating temperature range -40 +85 °C
P
IN
(50 )
TX input power (50 )
6,7
824-915 MHz
+38
dBm
TX input power (50 )
6,7
1710-1910 MHz
+36
RX input power (50 )
7
+23
P
IN
( :1)
TX input power (VSWR = ( :1)
6,7
824-915 MHz
+35
dBm
dBm
TX input power (VSWR = ( :1)
6,7
1710-1910 MHz
+33
V
ESD
ESD Voltage (HBM, MIL_STD
883 Method 3015.7)
1500 V
ESD Voltage (MM, JEDEC,
JESD22-A114-B)
100 V
Notes: 6. Assumes RF input period of 4620 µs and duty cycle of 50%.
7. V
DD
within operating range specified in Table 2.
Product Brief
PE42632
Page 3 of 4
Document No. 70-0226-01 www.psemi.com ©2007 Peregrine Semiconductor Corp. All rights reserved.
Contact sales@psemi.com for full version of datasheet
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Table 5. Truth Table
Table 6. Ordering Information
Table 4. Pin Descriptions Figure 4. Pad Configuration (Top View)
Path V3 V2 V1
ANT - TX1 0 1 1
ANT - TX2 0 0 1
ANT – RX1 1 1 0
ANT – RX2 0 1 0
ANT – RX3 1 0 0
ANT – RX4 0 0 0
8 7
5
6
11
13
2
14
10 3
9
4
1
12
15
16
TX1
GND
TX2
RX1
V
DD
V1
V2
V3
GND
RX4 RX3 RX2
GND
GND
GND ANT
PE4263 2 Die
Pin No. Pin Name Description
1 TX1
8
RF I/O – TX1
2 GND TX Ground
3 TX2
8
RF I/O – TX2
4 RX1
8
RF I/O – RX1
5 RX2
8
RF I/O – RX2
6 RX3
8
RF I/O – RX3
7 RX4
8
RF I/O – RX4
8 GND RX Ground
9 V3 Switch control input, CMOS logic level
10 V2 Switch control input, CMOS logic level
11 V1 Switch control input, CMOS logic level
12 V
DD
Supply
13 GND DC Ground
14 ANT
8
RF Common - Antenna
15 GND DC Ground
16 GND DC Ground
Note: 8. Blocking capacitors needed only when non-zero DC
voltage present
Order Code
Description Package Shipping Method
PE42632DTI PE42632-DIE-D
Bumped Wafer on Film Frame
Wafer (Gross Die / Wafer Quantity)
PE42632DBI PE42632-DIE-400G
Die in Waffle Pack
400 Dice / Waffle Pack
EK-42632-01 PE42632-DIE-1H Evaluation Kit 1/ box
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