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STTH102A

Part # STTH102A
Description ULTRA FAST RECOVERY RECTFR 200V 1A 2PIN SMA - Tape and Ree
Category DIODE
Availability Out of Stock
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1 + $0.04697



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

November 2006 Rev 5 1/7
7
STTH102
High efficiency ultrafast diode
Main product characteristics
Features and benefits
Very low conduction losses
Negligible switching losses
Low forward and reverse recovery times
High junction temperature
Description
The STTH102, which is using ST’s new 200 V
planar technology, is specially suited for switching
mode base drive and transistor circuits. The
device is also intended for use as a free wheeling
diode in power supplies and other power
switching applications.
Order codes
I
F(AV)
1 A
V
RRM
200 V
T
j
(max) 175° C
V
F
(max) 0.78 V
t
rr
(max) 20 ns
Part Number Marking
STTH102A U12
STTH102 STTH102
STTH102RL STTH102
K
A
K
A
SMA
(JEDEC DO-214AC)
STTH102A
DO-41
STTH102
Table 1. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
RRM
Repetitive peak reverse voltage 200 V
I
F(AV)
Average forward current
SMA T
L
= 148° C δ = 0.5
1A
DO-41 T
L
= 130° C δ = 0.5
I
FSM
Surge non repetitive forward
current
SMA
tp = 10 ms Sinusoidal
40
A
DO-41 50
T
stg
Storage temperature range -65 to + 175 °C
T
j
Maximum operating junction temperature 175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
www.st.com
Characteristics STTH102
2/7
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.65 x I
F(AV)
+ 0.130 I
F
2
(RMS)
Table 2. Thermal resistance
Symbol Parameter Value Unit
R
th(j-l)
Junction to lead
SMA 30
°C/W
Lead length = 10 mm DO-41 50
Table 3. Static Electrical Characteristics
Symbol Parameter Tests conditions Min. Typ Max. Unit
I
R
(1)
Reverse leakage current
T
j
= 25° C
V
R
= V
RRM
1
µA
T
j
= 125° C 1 25
V
F
(2)
Forward voltage drop
T
j
= 25° C
I
F
= 700 mA
(SMA)
0.90
V
I
F
= 1 A 0.97
T
j
= 125° C I
F
= 1 A 0.68 0.78
1. Pulse test: t
p
= 5 ms, δ < 2%
2. Pulse test: t
p
= 380 µs, δ < 2%
Table 4. Dynamic electrical characteristics
Symbol Parameter Tests conditions Min Typ Max Unit
t
rr
Reverse recovery time T
j
= 25° C
I
F
= 0.5 A I
rr
= 0.25 A
I
R
= 1 A
12 20 ns
t
fr
Forward recovery time T
j
= 25° C
I
F
= 1 A dI
F
/dt = 50 A/ms
V
FR
= 1.1 x V
F
max
50 ns
V
FP
Forward recovery voltage T
j
= 25° C I
F
= 1 A dI
F
/dt = 50 A/ms 1.8 V
Figure 1. Average forward power dissipation
versus average forward current
(SMA)
Figure 2. Average forward power dissipation
versus average forward current
(DO-41)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2
P (W)
F(AV)
I (A)
F(AV)
T
δ
=tp/T
tp
δ = 1
δ = 0.5
δ = 0.05
δ = 0.1
δ = 0.2
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.00 0.25 0.50 0.75 1.00 1.25
P (W)
F(AV)
I (A)
F(AV)
T
δ
=tp/T
tp
δ = 1
δ = 0.5
δ = 0.05
δ = 0.1
δ = 0.2
STTH102 Characteristics
3/7
Figure 3. Average forward current versus
ambient temperature (δ = 0.5) (SMA)
Figure 4. Average forward current versus
ambient temperature (δ = 0.5)
(DO-41)
I (A)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125 150 175
R =120°C/W
th(j-a)
R=R
th(j-a) th(j-I)
T
δ
=tp/T
tp
T (°C)
amb
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125 150 175
I (A)
F(AV)
R =110°C/W
th(j-a)
R=R
th(j-a) th(j-I)
T
δ
=tp/T
tp
T (°C)
amb
Figure 5. Relative variation of thermal
impedance junction to ambient
versus pulse duration (epoxy
printed circuit board, e
(Cu)
= 35 µm,
recommended pad layout) (SMA)
Figure 6. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
T
δ
=tp/T
tp
t (s)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
δ
= 0.5
δ
= 0.2
δ
= 0.1
Single pulse
Z/R
th(j-c) th(j-c)
T
δ
=tp/T
tp
t (s)
p
Figure 7. Forward voltage drop versus
forward current
Figure 8. Junction capacitance versus
reverse voltage applied
(typical values)
0.1
1.0
10.0
100.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
I (A)
FM
V (V)
FM
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
T =25°C
(maximum values)
j
1
10
100
1 10 100 1000
C(pF)
F=1MHz
V =30mV
T =25°C
OSC RMS
j
V (V)
R
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