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NDC7002N

Part # NDC7002N
Description TRANS MOSFET N-CH 50V 0.51A 6PIN SUPERSOT - Tape and Reel
Category DIODE
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

March 1996
NDC7002N
Dual N-Channel Enhancement Mode Field Effect Transistor
General Description Features
____________________________________________________________________________________________
Absolute Maximum RatingsT
A
= 25°C unless otherwise noted
Symbol Parameter NDC7002N Units
V
DSS
Drain-Source Voltage 50 V
V
GSS
Gate-Source Voltage - Continuous 20 V
I
D
Drain Current - Continuous (Note 1a) 0.51 A
- Pulsed 1.5
P
D
Maximum Power Dissipation (Note 1a) 0.96 W
(Note 1b)
0.9
(Note 1c)
0.7
T
J
,T
STG
Operating and Storage Temperature Range -55 to 150 °C
THERMAL CHARACTERISTICS
R
θ
JA
Thermal Resistance, Junction-to-Ambient (Note 1a) 130 °C/W
R
θ
JC
Thermal Resistance, Junction-to-Case (Note 1) 60 °C/W
NDC7002N.SAM
0.51A, 50V, R
DS(ON)
= 2 @ V
GS
=10V
High density cell design for low R
DS(ON)
.
Proprietary SuperSOT
TM
-6 package design using copper
lead frame for superior thermal and electrical capabilities.
High saturation current.
1
5
4
6
3
2
SOT-6 (SuperSOT
TM
-6)
These dual N-Channel enhancement mode power field
effect transistors are produced using Fairchild's
proprietary, high cell density, DMOS technology. This
very high density process has been designed to minimize
on-state resistance, provide rugged and reliable
performance and fast switching. These devices is
particularly suited for low voltage applications requiring a
low current high side switch.
© 1997 Fairchild Semiconductor Corporation
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage V
GS
= 0 V, I
D
= 250 µA 50 V
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 40 V, V
GS
= 0 V
1 µA
T
J
= 125°C
500
I
GSSF
Gate - Body Leakage, Forward
V
GS
= 20 V, V
DS
= 0 V
100 nA
I
GSSR
Gate - Body Leakage, Reverse
V
GS
= -20 V, V
DS
= 0 V
-100 nA
ON CHARACTERISTICS (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250 µA
1 1.9 2.5 V
T
J
= 125°C 0.8 1.5 2.2
R
DS(ON)
Static Drain-Source On-Resistance
V
GS
= 10 V, I
D
= 0.51 A
1 2
T
J
= 125°C
1.7 3.5
V
GS
= 4.5 V, I
D
= 0.35 A 1.6 4
I
D(on)
On-State Drain Current
V
GS
= 10 V, V
DS
= 10 V
1.5 A
g
FS
Forward Transconductance V
DS
= 10 V, I
D
= 0.51 A 400 mS
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
20 pF
C
oss
Output Capacitance 13 pF
C
rss
Reverse Transfer Capacitance 5 pF
SWITCHING CHARACTERISTICS (Note 2)
t
D(on)
Turn - On Delay Time V
DD
= 25 V, I
D
= 0.25 A,
V
GS
= 10 V, R
GEN
= 25
6 20 nS
t
r
Turn - On Rise Time 6 20
t
D(off)
Turn - Off Delay Time 11 20
t
f
Turn - Off Fall Time 5 20
Q
g
Total Gate Charge
V
DS
= 25 V,
I
D
= 0.51 A, V
GS
= 10 V
1 nC
Q
gs
Gate-Source Charge 0.19 nC
Q
gd
Gate-Drain Charge 0.33 nC
NDC7002N.SAM
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
DRAIN-SOURCE DIODE CHARACTERISTICS
I
S
Maximum Continuous Source Current 0.51 A
I
SM
Maximum Pulse Source Current (Note 2) 1.5 A
V
SD
Drain-Source Diode Forward Voltage V
GS
= 0 V, I
S
= 0.51 A (Note 2) 0.8 1.2 V
Notes:
1. R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is guaranteed by
design while R
θ
CA
is determined by the user's board design.
P
D
(
t
)
=
T
J
T
A
R
θJ A
(t)
=
T
J
T
A
R
θ
J C
+R
θ
CA
(t)
= I
D
2
(t) × R
DS(ON ) T
J
Typical R
θ
JA
for single device operation using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
a. 130
o
C/W when mounted on a 0.125 in
2
pad of 2oz cpper.
b. 140
o
C/W when mounted on a 0.005 in
2
pad of 2oz cpper.
c. 180
o
C/W when mounted on a 0.0015 in
2
pad of 2oz cpper.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
NDC7002N.SAM
1a 1b
1c
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