Name: MR750
SKU: MR750
Price: 0.83374 USD
Availability: InStock

1Rectifier Device Data



• Current Capacity Comparable to Chassis Mounted Rectifiers

• Very High Surge Capacity

• Insulated Case

Mechanical Characteristics:

• Case: Epoxy, Molded

• Weight: 2.5 grams (approximately)

• Finish: All External Surfaces Corrosion Resistant and Terminal Lead is

Readily Solderable

• Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds

• Polarity: Cathode Polarity Band

• Shipped 1000 units per plastic bag. Available Tape and Reeled, 800 units

per reel by adding a “RL’’ suffix to the part number

• Marking: R750, R751, R752, R754, R758, R760

MAXIMUM RATINGS

Characteristic Symbol MR750 MR751 MR752 MR754 MR756 MR758 MR760 Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RRM

RWM

50 100 200 400 600 800 1000 Volts

Non–Repetitive Peak Reverse Voltage

(Halfwave, single phase, 60 Hz peak)

RSM

60 120 240 480 720 960 1200 Volts

RMS Reverse Voltage V

R(RMS)

35 70 140 280 420 560 700 Volts

Average Rectified Forward Current

(Single phase, resistive load, 60 Hz)

See Figures 5 and 6

22 (T

= 60°C, 1/8″ Lead Lengths)

6.0 (T

= 60°C, P.C. Board mounting)

Amps

Non–Repetitive Peak Surge Current

(Surge applied at rated load conditions)

FSM

400 (for 1 cycle)

Amps

Operating and Storage Junction

Temperature Range

, T

stg

65 to +175

°C

ELECTRICAL CHARACTERISTICS

Characteristic and Conditions Symbol Max Unit

Maximum Instantaneous Forward Voltage Drop

= 100 Amps, T

= 25°C)

1.25 Volts

Maximum Forward Voltage Drop

= 6.0 Amps, T

= 25°C, 3/8″ leads)

0.90 Volts

Maximum Reverse Current T

= 25°C

(Rated dc Voltage) T

= 100°C

1.0

µA

Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit

curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.

Preferred devices are Motorola recommended choices for future use and best overall value.

 Motorola, Inc. 1996

Order this document

by MR750/D

SEMICONDUCTOR TECHNICAL DATA

HIGH CURRENT

LEAD MOUNTED

SILICON RECTIFIERS

50–1000 VOLTS

DIFFUSED JUNCTION

CASE 194–04

MR754 and MR760 are

Motorola Preferred Devices

Rev 2

2 Rectifier Device Data

Figure 1. Forward Voltage

Figure 2. Maximum Surge Capability

Figure 3. Forward Voltage Temperature Coefficient

Figure 4. Typical Transient Thermal Resistance

1.8 2.40.6

, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

700

500

, INSTANTANEOUS FORWARD CURRENT (AMP)

5.0

2.0

1.0

1.20.8 1.0 1.4 1.6 2.0 2.2

2.6

7.0

100

0.2

0.5

0.7

200

3.0

0.3

300

MAXIMUM

TYPICAL

= 25

NUMBER OF CYCLES AT 60 Hz

1001.0

300

100

2.0 5.0 10 20 50

200

400

600

, PEAK HALF WAVE CURRENT (AMP)

FSM

= 175

RRM

MAY BE APPLIED BETWEEN

EACH CYCLE OF SURGE. THE T

NOTED IS T

PRIOR TO SURGE

, INSTANTANEOUS FORWARD CURRENT (AMP)

1.00.2

+0.5

–0.5

–1.0

–1.5

–2.0

2.0

COEFFICIENT (mV/ C)

10 20 100 2000.5 5.0 50

TYPICAL RANGE

t, TIME (SECONDS)

1.0

0.2

2.0 5.0 10 20 50

5.0

3.0

2.0

0.5

0.3

0.1 0.2 0.3 0.5 0.7 3.0 307.0 70

Both leads to heat sink, with lengths as shown. Variations in R

JL(t)

below 2.0 seconds are independent of lead connections of 1/8 inch

or greater, and vary only about

20% from the values shown. Values

for times greater than 2.0 seconds may be obtained by drawing a

curve, with the end point (at 70 seconds) taken from Figure 8, or

calculated from the notes, using the given curves as a guide. Either

typical or maximum values may be used. For R

JL(t)

values at pulse

widths less than 0.1 second, the above curve can be extrapolated

down to 10

s at a continuing slope.

THERMAL RESISTANCE ( C/W)

175

1/2”

3/8”

1/4”

1/8”

, JUNCTION–TO–LEAD TRANSIENT

JL(t)

HEAT SINK

L L

3Rectifier Device Data

Figure 5. Maximum Current Ratings

, LEAD TEMPERATURE (

8.0

F(AV)

40 80 120 160 200

Figure 6. Maximum Current Ratings

0 8.0

4.0

16 24 32

F(AV)

, AVERAGE FORWARD CURRENT (AMPS)

F(AV)

Figure 7. Power Dissipation

, POWER DISSIPATION (WATTS)

5/8”

, AVERAGE FORWARD CURRENT (AMPS)

CAPACITANCE LOADS

8.0

RESISTIVE INDUCTIVE

LOADS

, AMBIENT TEMPERATURE (

1.0

F(AV)

2.0

3.0

4.0

40 80 120 160 200

Figure 8. Steady State Thermal Resistance

f = 60 Hz

, AVERAGE FORWARD CURRENT (AMPS)

RESISTIVE INDUCTIVE LOADS

CAPACITANCE LOADS – 1

& 3

1 & 3

20 I

avg

A(A)

A(K)

L(A)

C(A)

C(K)

L(K)

S(A)

L(A)

J(A)

θJ(K)

L(K)

S(K)

Use of the above model permits junction to lead thermal resistance for

any mounting configuration to be found. Lowest values occur when one

side of the rectifier is brought as close as possible to the heat sink as

shown below. Terms in the model signify:

= Ambient Temperature T

= Case Temperature

= Lead Temperature T

= Junction Temperature

= Thermal Resistance, Heat Sink to Ambient

= Thermal Resistance, Lead to Heat Sink

= Thermal Resistance, Junction to Case

= Power Dissipation

(Subscripts A and K refer to anode and cathode sides, respectively.)

Values for thermal resistance components are:

= 40

C/W/in. Typically and 44

C/W/in Maximum.

= 2

C/W typically and 4

C/W Maximum.

Since R

is so low, measurements of the case temperature, T

, will be

approximately equal to junction temperature in practical lead mounted

applications. When used as a 60 Hz rectifierm the slow thermal response

holds T

J(PK)

close to T

J(AVG)

. Therefore maximum lead temperature may

be found from: T

= 175

–R

. P

may be found from Figure 7.

The recommended method of mounting to a P.C. board is shown on the

sketch, where R

is approximately 25

C/W for a 1–1/2” x 1–1/2” copper

surface area. Values of 40

C/W are typical for mounting to terminal strips

or P.C. boards where available surface area is small.

Board Ground Plane

Recommended mounting for half wave circuit

0 1/4

5.0

1/2 3/4 1.0

L, LEAD LENGTH (INCHES)

, THERMAL RESISTANCE,

SINGLE LEAD TO HEAT SINK,

INSIGNIFICANT HEAT FLOW

THROUGH OTHER LEAD

4.0

20 60 100 140 180

4.0 12 20 28

1/8 3/8 5/8 7/8

JUNCTION–TO–LEAD( C/W)

BOTH LEADS TO HEAT

SINK WITH LENGTHS

AS SHOWN

3/8”

1/4”

L = 1/8”

20 60 100 140 180

5.0

6.0

7.0

(pk)

= 5 I

avg

(pk)

= 10 I

avg

(pk)

= 20 I

avg

10 I

avg

(pk)

= 5 I

avg

RESISTIVE – INDUCTIVE LOADS

BOTH LEADS TO HEAT

SINK, EQUAL LENGTH

6 (I

AVE

= 6.28)

SEE NOTE

= 40

C/W

SEE NOTE

= 25

C/W

NOTES

THERMAL CIRCUIT MODEL

(For Heat Conduction Through The Leads)

Part #	MR750
Description	DIODE GP 50V 6A MICRODE BUTTON
Category	DIODE
Availability	In Stock
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MR750

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