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1N256

Part # 1N256
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

K51P144M100SF2
K51 Sub-Family Data Sheet
Supports the following:
MK51N256CLQ100,
MK51N256CMD100,
MK51N512CLQ100,
MK51N512CMD100
Features
Operating Characteristics
Voltage range: 1.71 to 3.6 V
Flash write voltage range: 1.71 to 3.6 V
Temperature range (ambient): -40 to 85°C
Performance
Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
Memories and memory interfaces
Up to 512 KB program flash memory on non-
FlexMemory devices
Up to 128 KB RAM
Serial programming interface (EzPort)
FlexBus external bus interface
Clocks
3 to 32 MHz crystal oscillator
32 kHz crystal oscillator
Multi-purpose clock generator
System peripherals
10 low-power modes to provide power optimization
based on application requirements
Memory protection unit with multi-master
protection
16-channel DMA controller, supporting up to 64
request sources
External watchdog monitor
Software watchdog
Low-leakage wakeup unit
Security and integrity modules
Hardware CRC module to support fast cyclic
redundancy checks
128-bit unique identification (ID) number per chip
Human-machine interface
Segment LCD controller supporting up to 40
frontplanes and 8 backplanes, or 44 frontplanes and
4 backplanes
Low-power hardware touch sensor interface (TSI)
General-purpose input/output
Analog modules
Two 16-bit SAR ADCs
Programmable gain amplifier (up to x64) integrated
into each ADC
Two 12-bit DACs
Two operational amplifiers
Two transimpedance amplifiers
Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
Voltage reference
Timers
Programmable delay block
Eight-channel motor control/general purpose/PWM
timer
Two 2-channel quadrature decoder/general purpose
timers
Periodic interrupt timers
16-bit low-power timer
Carrier modulator transmitter
Real-time clock
Communication interfaces
USB full-/low-speed On-the-Go controller with on-
chip transceiver
Three SPI modules
Two I2C modules
Six UART modules
Secure Digital host controller (SDHC)
I2S module
Freescale Semiconductor
Document Number: K51P144M100SF2
Data Sheet: Product Preview
Rev. 4, 3/2011
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2011 Freescale Semiconductor, Inc.
Preliminary
Table of Contents
1 Ordering parts...........................................................................4
1.1 Determining valid orderable parts......................................4
2 Part identification......................................................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................11
5.1 Nonswitching electrical specifications...............................11
5.1.1 Voltage and current operating requirements.........11
5.1.2 LVD and POR operating requirements.................12
5.1.3 Voltage and current operating behaviors..............13
5.1.4 Power mode transition operating behaviors..........13
5.1.5 Power consumption operating behaviors..............14
5.1.6 EMC radiated emissions operating behaviors.......17
5.1.7 Designing with radiated emissions in mind...........18
5.1.8 Capacitance attributes..........................................18
5.2 Switching specifications.....................................................18
5.2.1 Device clock specifications...................................18
5.2.2 General switching specifications...........................19
5.3 Thermal specifications.......................................................20
5.3.1 Thermal operating requirements...........................20
5.3.2 Thermal attributes.................................................20
6 Peripheral operating requirements and behaviors....................20
6.1 Core modules....................................................................21
6.1.1 Debug trace timing specifications.........................21
6.1.2 JTAG electricals....................................................21
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1 MCG specifications...............................................25
6.3.2 Oscillator electrical specifications.........................27
6.3.3 32kHz Oscillator Electrical Characteristics............29
6.4 Memories and memory interfaces.....................................30
6.4.1 Flash (FTFL) electrical specifications....................30
6.4.2 EzPort Switching Specifications............................32
6.4.3 Flexbus Switching Specifications..........................33
6.5 Security and integrity modules..........................................35
6.6 Analog...............................................................................35
6.6.1 ADC electrical specifications.................................35
6.6.2 CMP and 6-bit DAC electrical specifications.........43
6.6.3 12-bit DAC electrical characteristics.....................46
6.6.4 Op-amp electrical specifications...........................49
6.6.5 Transimpedance amplifier electrical
specifications — full range....................................50
6.6.6 Transimpedance amplifier electrical
specifications — limited range..............................51
6.6.7 Voltage reference electrical specifications............52
6.7 Timers................................................................................53
6.8 Communication interfaces.................................................54
6.8.1 USB electrical specifications.................................54
6.8.2 USB DCD electrical specifications........................54
6.8.3 USB VREG electrical specifications......................54
6.8.4 DSPI switching specifications (low-speed mode)..55
6.8.5 DSPI switching specifications (high-speed mode) 56
6.8.6 I2C switching specifications..................................58
6.8.7 UART switching specifications..............................58
6.8.8 SDHC specifications.............................................58
6.8.9 I2S switching specifications..................................59
6.9 Human-machine interfaces (HMI)......................................61
6.9.1 TSI electrical specifications...................................61
6.9.2 LCD electrical characteristics................................62
7 Dimensions...............................................................................63
7.1 Obtaining package dimensions.........................................63
8 Pinout........................................................................................64
K51 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
2
Preliminary
Freescale Semiconductor, Inc.
8.1 K51 Signal Multiplexing and Pin Assignments..................64
8.2 K51 Pinouts.......................................................................70
9 Revision History........................................................................72
K51 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
3
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