TQP7M9102

½W High Linearity Amplifier

Typical Performance 2110-2170 MHz

Frequency MHz 2110 2140 2170

Gain dB 17.9 17.8 17.7

Input Return Loss dB -12 -12 -11

Output Return Loss dB -12 -11 -10

Output P1dB dBm +27.8 +27.6 +27.4

Output IP3 (+9 dBm/tone, ∆f = 1 MHz)

dBm +43.6 +43.5 +43.6

WCDMA Channel Power (at -50 dBc ACLR) [1] dBm +18.5 +18.4 +18.3

Noise Figure dB 3.8

Notes:

1. ACLR Test set-up: 3GPP WCDMA, TM1+64 DPCH, +5 MHz offset, PAR = 10.2 dB at 0.01% Prob.

RF Performance Plots 2110-2170 MHz

15

16

17

18

19

20

2110 2120 2130 2140 2150 2160 2170

Gain (dB)

Freq (MHz)

Gain vs. Frequency

−40

°

C

+25

°

C

3.9 4.0

Supply Voltage, Vcc V 5

Quiescent Collector Current, Icq mA 137

-20

-15

-10

-5

0

2110 2120 2130 2140 2150 2160 2170

Retun Loss (dB)

Freq (MHz)

Input Return Loss vs. Frequency

−40

°

C

+25

°

C

-20

-15

-10

-5

0

2110 2120 2130 2140 2150 2160 2170

Retun Loss (dB)

Freq (MHz)

Output Return Loss vs. Frequency

−40

°

C

+25

°

C

+8

5

°

C

+8

5

°

C

+85

°

C

-65

-60

-55

-50

-45

-40

-35

14 15 16 17 18 19 20

ACLR (dBc)

Pout (dBm)

ACLR Vs. Output Power

38

40

42

44

46

7 9 11 13 15 17

OIP3 (dBm)

Pout/Tone (dBm)

OIP3 Vs. Pout/Tone

25

26

27

28

29

30

2110 2120 2130 2140 2150 2160 2170

P1dB (dBm)

Frequency (MHz)

P1dB vs. Frequency

−40

°

C

+25

°

C

W-CDMA 3GPP Test Model 1+64 DPCH

PAR = 10.2 dB @ 0.01% Probability

3.84 MHz BW

Data Sheet: Rev D 10/04/11

- 6 of 9 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network

®

+85

°

C

+25

°

C

−40

°

C

Freq.= 2140 MHz

+85

°

C

+25

°

C

−40

°

C

Freq.=2140 MHz

1 MHz Tone Spacing

+8

5

°

C

-65

-60

-55

-50

-45

-40

-35

14 15 16 17 18 19 20

ACLR (dBc)

Pout (dBm)

ACLR Vs. Output Power

38

40

42

44

46

7 9 11 13 15 17

OIP3 (dBm)

Pout/Tone (dBm)

OIP3 Vs. Pout/Tone

2170 MHz

2140 MHz

2110 MHz

W-CDMA 3GPP Test Model 1+64 DPCH

PAR = 10.2 dB @ 0.01% Probability

3.84 MHz BW

Temp.=+25

°

C

2170 MHz

2140 MHz

2110 MHz

W-CDMA 3GPP Test Model 1+64 DPCH

PAR = 10.2 dB @ 0.01% Probability

3.84 MHz BW

1 MHz Tone Spacing

Te

mp.=+25

°

C

19

21

23

25

27

29

2468101

Pout (dBm)

Pin (dBm)

Output Power vs. Input Power

2

Freq.=2140 MHz

−40

°

C

+25

°

C

+8

5

°

C

TQP7M9102

½W High Linearity Amplifier

Pin Configuration and Description

RF IN GND RF OUT

GND

1

23

4

Pin Symbol Description

1 RF IN

RF Input. Requires external match for optimal performance. External DC Block

required.

2, 4 GND RF/DC Ground Connection

3 RFout / Vcc

RF Output. Requires external match for optimal performance. External DC Block

and supply voltage is required.

Applications Information

PC Board Layout

Data Sheet: Rev D 10/04/11

- 7 of 9 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network

®

PCB Material (stackup):

1071363AW REV - 1071363PC REV -

GND

+V

CC

SOT89 EVAL. BRD., 1/2 WATT

1 oz. Cu top layer

0.014 inch Nelco N-4000-13, ε

r

=3.7

1 oz. Cu MIDDLE layer 1

Core Nelco N-4000-13

1 oz. Cu middle layer 2

0.014 inch Nelco N-4000-13

1 oz. Cu bottom layer

Finished board thickness is 0.062±.006

50 ohm line dimensions: width = .031”, spacing = .035”.

The pad pattern shown has been developed and tested for

optimized assembly at TriQuint Semiconductor. The PCB

land pattern has been developed to accommodate lead and

package tolerances. Since surface mount processes vary

from supplier to supplier, careful process development is

recommended.

TQP7M9102

½W High Linearity Amplifier

Mechanical Information

Package Information and Dimensions

This package is lead-free/RoHS-

compliant. The plating material on the

leads is NiPdAu. It is compatible with

both lead-free (maximum 260 °C reflow

temperature) and lead (maximum 245 °C

reflow temperature) soldering processes.

Data Sheet: Rev D 10/04/11

- 8 of 9 -

Disclaimer: Subject to change without notice

Connecting the Digital World to the Global Network

®

Th

e component will be marked with a

“7M9102” designator with an

alphanumeric lot code on the top surface

of package.

7M9102

Mounting Configuration

All dimensions are in millimeters (inches). Angles are in degrees.

Notes:

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. RF trace width depends upon the PC board material and construction.

4. Use 1 oz. Copper minimum.

Part #	06032U1R5BAT2A
Description	CAP 1.5PF 200VDC C0G 0.1PF SMD 0603 - Tape and Reel Additional Information:
Category	CAPACITOR
Availability	In Stock
Qty	4000

Qty	Price
1 - 840	$0.05295
841 - 1,680	$0.04212
1,681 - 2,520	$0.03971
2,521 - 3,360	$0.03690
3,361 +	$0.03289

06032U1R5BAT2A

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Technical Document