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C2012X7R1A475M

Part # C2012X7R1A475M
Description Cap Ceramic 4.7uF 10V X7R 20%SMD 0805 125C Plastic T/R
Additional Information:


Category CAPACITOR
Availability In Stock
Qty 17119
Qty Price
1 - 1,549 $0.09681
1,550 - 3,895 $0.07701
3,896 - 7,575 $0.07261
7,576 - 11,486 $0.06747
11,487 + $0.06014
Manufacturer Available Qty
TDK Corporation
Date Code: 1110
  • Shipping Freelance Stock: 17119
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Multilayer Ceramic Chip Capacitors
1 of 3
Creation Date : May 19, 2017 (GMT)
C2012X7R1A475M085AC
TDK item description C2012X7R1A475MT****
Applications Commercial Grade
Feature General General (Up to 50V)
Series C2012 [EIA 0805]
Status Production
Size
Length(L) 2.00mm ±0.20mm
Width(W) 1.25mm ±0.20mm
Thickness(T) 0.85mm ±0.15mm
Terminal Width(B) 0.20mm Min.
Terminal Spacing(G) 0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance 4.7μF ±20%
Rated Voltage 10VDC
Temperature Characteristic X7R(±15%)
Dissipation Factor (Max.) 10%
Insulation Resistance (Min.) 21MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200 No
Packing Punched (Paper)Taping [180mm Reel]
Package Quantity 4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
2 of 3
Creation Date : May 19, 2017 (GMT)
C2012X7R1A475M085AC
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C2012X7R1A475M085AC
ESR
C2012X7R1A475M085AC
Capacitance
C2012X7R1A475M085AC
DC Bias Characteristic
C2012X7R1A475M085AC
Ripple Temperature Rising
C2012X7R1A475M085AC(100kHz) C2012X7R1A475M085AC(500kHz) C2012X7R1A475M085AC(1MHz)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
3 of 3
Creation Date : May 19, 2017 (GMT)
C2012X7R1A475M085AC
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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