Name: TPS54620RGYR
SKU: TPS54620RGYR
Price: 1.44950 USD
Availability: OutOfStock

FEATURES

APPLICATIONS

DESCRIPTION

100

Efficiency-%

0 1 2 3 4 5 6

LoadCurrent- A

8V

12V

17V

VOUT =3.3V

Fsw=480kHz

PVIN

GND

BOOT

VSENSE

COMP

TPS54620

RT/CLK

SS/TR

PowerPAD

Css

Rrt

Cboot

Cin

VIN

VOUT

PWRGD

TPS54620

www.ti.com

........................................................................................................................................................................................................ SLVS949 – MAY 2009

17V Input, 6A Output, Synchronous Step Down Switcher

With Integrated FET in 3.5mm x 3.5mm Package( SWIFT™)

• Power Good Output Monitor for Undervoltage

& Overvoltage

• Integrated 26m Ω / 19m Ω MOSFETs

• Adjustable Input Undervoltage Lockout

• Split Power Rail: 1.6V to 17V on PVIN

• Supported by SwitcherPro™ Software Tool

• 200kHz to 1.6MHz Switching Frequency

• For SWIFT™ Documentation and

• Synchronizes to External Clock

SwitcherPro™, visit http://www.ti.com/swift

• 0.8V ± 1% Voltage Reference Over Temperature

• Low 2uA Shutdown Quiscent Current

• Monotonic Start-Up into Prebiased Outputs

• High Density Distributed Power Systems

• – 40 ° C to 150 ° C Operating Junction

• High Peformance Point of Load Regulation

Temperature Range

• Broadband, Networking and Optical

• Adjustable Slow Start/Power Sequencing

Communications Infrastructure

The TPS54620 in thermally enhanced 3.5mm x 3.5mm QFN package is a full featured 17V, 6A synchronous step

down converter which is optimized for small designs through high efficiency and integrating the high-side and

low-side MOSFETs. Further space savings are achieved through current mode control, which reduces

component count, and by selecting a high switching frequency, reducing the inductor ' s footprint.

The output voltage startup ramp is controlled by the SS/TR pin which allows operation as either a stand alone

power supply or in tracking situations. Power sequencing is also possible by correctly configuring the enable and

the open drain power good pins.

Cycle by cycle current limiting on the high-side fet protects the device in overload situations and is enhanced by

a low-side sourcing current limit which prevents current runaway. There is also a low-side sinking current limit

which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part

when die temperature rises too high.

WHITE SPACE

SIMPLIFIED SCHEMATIC

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 SWIFT, PowerPAD are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

ABSOLUTE MAXIMUM RATINGS

(1)

TPS54620

SLVS949 – MAY 2009 ........................................................................................................................................................................................................

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

(1)

PACKAGE PART NUMBER

(2)

– 40 ° C to 150 ° C 14 Pin QFN TPS54620RGY

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com .

(2) The RGY package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54620RGYR). See applications

section of data sheet for layout information

over operating temperature range (unless otherwise noted)

VALUE UNIT

VIN – 0.3 to 20 V

PVIN – 0.3 to 20 V

EN – 0.3 to 3 V

BOOT – 0.3 to 27 V

Input Voltage VSENSE – 0.3 to 3 V

COMP – 0.3 to 3 V

PWRGD – 0.3 to 6 V

SS/TR – 0.3 to 3 V

RT/CLK – 0.3 to 6 V

BOOT-PH 0 to 7 V

Output Voltage PH – 1 to 20 V

PH 10ns Transient – 3 to 20 V

Vdiff(GND to PowerPAD) – 0.2 to 0.2 V

RT/CLK ± 100 µ A

Source Current

PH Current Limit A

PVIN Current Limit A

Sink Current

COMP ± 200 µ A

PWRGD – 0.1 to 5 mA

Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A) 2 kV

Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01) 500 V

Operating Junction Temperature – 40 to 150 ° C

Storage Temperature – 65 to 150 ° C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Product Folder Link(s) :TPS54620

PACKAGE DISSIPATION RATINGS

(1) (2) (3)

ELECTRICAL CHARACTERISTICS

TPS54620

www.ti.com

THERMAL IMPEDANCE ψ

THERMAL CHARACTERISTIC

PACKAGE

JUNCTION TO AMBIENT JUNCTION TO TOP

RGY 32 ° C/W 5 ° C/W

(1) Maximum power dissipation may be limited by overcurrent protection

(2) Power rating at a specific ambient temperature T

should be determined with a junction temperature of 150 ° C. This is the point where

distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below

150 ° C for best performance and long-term reliability. See power dissipation estimate in application section of this data sheet for more

information.

(3) Test board conditions:

a. 2.5 inches × 2.5 inches, 4 layers, thickness: 0.062 inch

b. 2 oz. copper traces located on the top of the PCB

c. 2 oz. copper ground planes on the 2 internal layers and bottom layer

d. 4 thermal vias located under the device package

= – 40 ° C to 150 ° C, VIN = 4.5V to 17V, PVIN = 1.6V to 17V (unless otherwise noted)

DESCRIPTION CONDITIONS MIN TYP MAX UNIT

SUPPLY VOLTAGE (VIN AND PVIN PINS)

PVIN operating input voltage 1.6 17 V

VIN operating input voltage 4.5 17 V

VIN internal UVLO threshold VIN rising 4.0 4.5 V

VIN internal UVLO hysterisis 150 mV

VIN shutdown supply Current EN = 0 V 2 5 µ A

VIN operating – non switching supply current VSENSE = 810 mV 600 800 µ A

ENABLE AND UVLO (EN PIN)

Enable threshold Rising 1.21 1.26 V

Enable threshold Falling 1.10 1.17

Input current EN = 1.1 V 1.15 µ A

Hysteresis current EN = 1.3 V 3.4 µ A

VOLTAGE REFERENCE

Voltage reference 0 A ≤ Iout ≤ 6 A 0.792 0.800 0.808 V

MOSFET

High-side switch resistance BOOT-PH = 3 V 32 60 m Ω

High-side switch resistance

(1)

BOOT-PH = 6 V 26 40 m Ω

Low-side Switch Resistance

(1)

VIN = 12 V 19 30 m Ω

ERROR AMPLIFIER

Error amplifier Transconductance (gm) – 2 µ A < ICOMP < 2 µ A, V(COMP) = 1 V 1300 µ Mhos

Error amplifier dc gain VSENSE = 0.8 V 1000 3100 V/V

Error amplifier source/sink V(COMP) = 1 V, 100 mV input overdrive ± 110 µ A

Start switching threshold 0.25 V

COMP to Iswitch gm 16 A/V

CURRENT LIMIT

High-side switch current limit threshold 8 11 A

Low-side switch sourcing current limit 7 10 A

Low-side switch sinking current limit 2.3 A

(1) Measured at pins

Product Folder Link(s) :TPS54620

Part #	TPS54620RGYR
Description	Conv DC-DC Single Step Down 1.6V to 17V 14-Pin VQFN EP T/R
Category	IC
Availability	Out of Stock
Qty	0

TPS54620RGYR

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