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GRM31CR71H225KA88L

Part # GRM31CR71H225KA88L
Description CAP 2.2UF 50VDC X7R 10% SMD 1206 - Cut TR (SOS)
Category CHIP RESISTOR
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

AFT09MS031NR1 AFT09MS031GNR1
1
RF Device Data
Freescale Semiconductor, Inc.
RF Power LDMOS Transistors
High Ruggedness N--Channel
Enhancement--Mode Lateral MOSFETs
Designed for mobile two -- way radio applications with frequencies from
764 to 941 MHz. The high gain, ruggedness and broadband performance of
these devices make them ideal for large--signal, common sourc e amplifier
applications in mobile radio equipment.
Narrowband Performance
(13.6 Vdc, I
DQ
= 500 mA, T
A
=25°C, CW)
Frequency
(MHz)
G
ps
(dB)
η
D
(%)
P1dB
(W)
764 18.0 74.1 32
870 17.2 71.0 31
941 15.7 68.1 31
800 MHz B roadband Performance (13.6 Vdc, I
DQ
= 100 mA, T
A
=25°C, CW)
Frequency
(MHz)
G
ps
(dB)
η
D
(%)
P1dB
(W)
760 15.7 62.0 44
820 15.7 63.0 37
870 15.5 61.0 36
Load Mismatch/Ruggedness
Frequency
(MHz)
Signal
Type
VSWR
P
out
(W)
Test
Voltage
Result
870 CW >65:1 at all
Phase Angles
54
(3 dB Overdrive)
17 No Device
Degradation
Features
Characterized for Operation from 764 to 941 MHz
Unmatched Input and Output Allowing Wide Frequency Range Utilization
Integrated ESD Protection
Integrated Stability Enhancements
Wideband Full Power Across the Band (764–870 MHz)
225°C Capable Plastic Package
Exceptional Thermal Performance
High Linearity for: TETRA, SSB, LTE
Cost--effective Over--molded Plastic Packaging
In Tape and Reel. R1 Suffix = 500 Units, 24 mm Tape Width, 13 inch Reel.
Typical Applications
Output Stage 800 MHz Trunking Band Mobile Radio
Output Stage 900 MHz Trunking Band Mobile Radio
Document Number: AFT09MS031N
Rev. 0, 5/2012
Freescale Semiconductor
Technical Data
764--941 MHz, 31 W, 13.6 V
WIDEBAND
RF POWER LDMOS TRANSISTORS
AFT09MS031NR1
AFT09MS031GNR1
T O -- 2 7 0 -- 2
PLASTIC
AFT09MS031NR1
Figure 1. Pin Connections
(Top View)
Drain
Gate
Note: The backside of the package is the
source terminal for the transistor.
T O -- 2 7 0 -- 2 G U L L
PLASTIC
AFT09MS031GNR1
© Freescale Semiconductor, Inc., 2012.
A
ll rights reserved.
2
RF Device Data
Freescale Semiconductor, Inc.
AFT09MS031NR1 AFT09MS031GNR1
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain--Source Voltage V
DSS
--0.5, +40 Vdc
Gate--Source Voltage V
GS
--6.0, +12 Vdc
Operating Voltage V
DD
17, +0 Vdc
Storage Temperature Range T
stg
--65 to +150 °C
Case Operating Temperature T
C
--40 to +150 °C
Operating Junction Temperature
(1,2)
T
J
--40 to +225 °C
Total Device Dissipation @ T
C
=25°C
Derate above 25°C
P
D
317
1.59
W
W/°C
Table 2. Thermal Characteristics
Characteristic Symbol Value
(2,3)
Unit
Thermal Resistance, Junction to Case
Case Temperature 81°C, 31 W CW, 13.6 Vdc, I
DQ
= 500 mA, 870 MHz
R
θ
JC
0.63 °C/W
Table 3. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD22--A114) 2, passes 2500 V
Machine Model (per EIA/JESD22--A115) A, passes 100 V
Charge Device Model (per JESD22--C101) IV, passes 1200 V
Table 4. Moisture Sensitivity Level
Test Methodology Rating Package Peak Temperature Unit
Per JESD22--A113, IPC/JEDEC J--STD--020 3 260 °C
Table 5. Electrical Characteristics (T
A
=25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(V
DS
=40Vdc,V
GS
=0Vdc)
I
DSS
2 μAdc
Zero Gate Voltage Drain Leakage Current
(V
DS
= 13.6 Vdc, V
GS
=0Vdc)
I
DSS
1 μAdc
Gate--Source Leakage Current
(V
GS
=5Vdc,V
DS
=0Vdc)
I
GSS
600 nAdc
On Characteristics
Gate Threshold Voltage
(V
DS
=10Vdc,I
D
=115μAdc)
V
GS(th)
1.6 2.1 2.6 Vdc
Drain--Source On--Voltage
(V
GS
=10Vdc,I
D
=1.2Adc)
V
DS(on)
0.1 Vdc
Forward Transconductance
(V
GS
=10Vdc,I
D
=10Adc)
g
fs
7.8 S
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf
. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf
.
Select Documentation/Application Notes -- AN1955.
(continued)
AFT09MS031NR1 AFT09MS031GNR1
3
RF Device Data
Freescale Semiconductor, Inc.
Table 5. Electrical Characteristics
(T
A
=25°C unless otherwise noted) (continued)
Characteristic Symbol Min Typ Max Unit
Dynamic Characteristics
Reverse Transfer Capacitance
(V
DS
= 13.6 Vdc ± 30 mV(rms)ac @ 1 MHz, V
GS
=0Vdc)
C
rss
2.1 pF
Output Capacitance
(V
DS
= 13.6 Vdc ± 30 mV(rms)ac @ 1 MHz, V
GS
=0Vdc)
C
oss
63 pF
Input Capacitance
(V
DS
= 13.6 Vdc, V
GS
=0Vdc± 30 mV(rms)ac @ 1 MHz)
C
iss
140 pF
Functional Tests
(1)
(In Freescale Narrowband Test Fixture, 50 ohm system) V
DD
= 13.6 Vdc, I
DQ
= 500 mA, P
out
=31W,f=870MHz
Common--Source Amplifier Power Gain
G
ps
16.0 17.2 18.5 dB
Drain Efficiency η
D
68.0 71.0 %
Load Mismatch/Ruggedness (In Freescale Test Fixture, 50 ohm system, I
DQ
= 500 mA)
Frequency
(MHz)
Signal
Type
VSWR
P
out
(W) Test Voltage, V
DD
Result
870 CW >65:1 at all Phase Angles 54
(3 dB Overdrive)
17 No Device Degradation
1. Measurement made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for gull
wing (GN) parts.
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