8
Assembly Information
0.026
0.075
0.016
0.035
Figure 22. PCB Pad Layout, SOT-363.
(dimensions in inches).
0.026
0.035
0.07
0.016
Figure 23. PCB Pad Layout, SOT-323.
(dimensions in inches).
0.037
0.95
0.037
0.95
0.079
2.0
0.031
0.8
DIMENSIONS IN
inches
mm
0.035
0.9
Figure 24. PCB Pad Layout, SOT-23.
DIMENSIONS IN
inches
mm
0.075
1.9
0.071
1.8
0.112
2.85
0.079
2
0.033
0.85
0.041
1.05
0.108
2.75
0.033
0.85
0.047
1.2
0.031
0.8
0.033
0.85
Figure 25. PCB Pad Layout, SOT-143.
TIME (seconds)
T
MAX
TEMPERATURE (°C)
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120 180 240 300
Figure 26. Surface Mount Assembly Profile.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 26. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 235°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
