Surface Mount RF PIN

Switch Diodes

Technical Data

Features

• Unique Configurations in

Surface Mount Packages

– Add Flexibility

– Save Board Space

– Reduce Cost

• Switching

– Low Capacitance

– Low Resistance at Low

Current

• Low Failure in Time (FIT)

Rate

[1]

• Matched Diodes for

Consistent Performance

• Better Thermal

Conductivity for Higher

Power Dissipation

• Lead-free Option Available

Note:

1. For more information see the

Surface Mount PIN Reliability Data

Sheet.

HSMP-389x Series

HSMP-489x Series

Description/Applications

The HSMP-389x series is

optimized for switching applica-

tions where low resistance at low

current and low capacitance are

required. The HSMP-489x series

products feature ultra low

parasitic inductance. These

products are specifically

designed for use at frequencies

which are much higher than the

upper limit for conventional PIN

diodes.

GUx

Notes:

1. Package marking provides

orientation, identification, and

date code.

2. See “Electrical Specifications” for

appropriate package marking.

Pin Connections and

Package Marking

Package Lead Code

Identification, SOT-23/143

(Top View)

Package Lead Code

Identification, SOT-323

(Top View)

Package Lead Code

Identification, SOT-363

(Top View)

Absolute Maximum Ratings

[1]

= +25°C

Symbol Parameter Unit SOT-23/143 SOT-323/363

Forward Current (1 µs Pulse) Amp 1 1

Peak Inverse Voltage V 100 100

Junction Temperature °C 150 150

stg

Storage Temperature °C -65 to 150 -65 to 150

Thermal Resistance

[2]

°C/W 500 150

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to

the device.

2. T

= +25°C, where T

is defined to be the temperature at the package pins where

contact is made to the circuit board.

ESD WARNING:

Handling Precautions Should Be

Taken To Avoid Static Discharge.

COMMON

CATHODE

COMMON

ANODE

SERIES

SINGLE

UNCONNECTED

PAIR

DUAL ANODE

4890

COMMON

CATHODE

COMMON

ANODE

SERIES

SINGLE

DUAL ANODE

489B

SERIES–

SHUNT PAIR

LOW

INDUCTANCE

SINGLE

UNCONNECTED

TRIO

123

654

123

654

123

654

HIGH

FREQUENCY

SERIES

123

654

DUAL SWITCH

MODEL

123

654

Electrical Specifications, T

= 25°C, each diode

Package Minimum Maximum Maximum

Part Number Marking Lead Breakdown Series Resistance Total Capacitance

HSMP- Code Code Configuration Voltage V

(V) R

(Ω)C

(pF)

3890 G0

[1]

0 Single 100 2.5 0.30

3892 G2

[1]

2 Series

3893 G3

[1]

3 Common Anode

3894 G4

[1]

4 Common Cathode

3895 G5

[1]

5 Unconnected Pair

389B G0

[2]

B Single

389C G2

[2]

C Series

389E G3

[2]

E Common Anode

389F G4

[2]

F Common Cathode

389L GL

[2]

L Unconnected Trio

389R S

[2]

R Dual Switch Mode

389T Z

[2]

T Low Inductance Single

389U GU

[2]

U Series-Shunt Pair

389V GV

[2]

V High Frequency Series Pair

Test Conditions V

= V

= 5 mA V

= 5 V

Measure f = 100 MHz f = 1 MHz

≤ 10 µA

Notes:

1. Package marking code is white.

2. Package is laser marked.

High Frequency (Low Inductance, 500 MHz– 3 GHz) PIN Diodes

Minimum Maximum Typical Maximum Typical

Part Package Breakdown Series Total Total Total

Number Marking Voltage Resistance Capacitance Capacitance Inductance

HSMP- Code

[1]

Configuration V

(V) R

(Ω)C

(pF) C

(pF) L

(nH)

489x GA Dual Anode 100 2.5 0.33 0.375 1.0

Test Conditions V

= V

= 5 mA f = 1 MHz V

= 5 V f = 500 MHz–

Measure V

= 5 V f = 1 MHz 3 GHz

≤ 10 µA

Note:

1. SOT-23 package marking code is white; SOT-323 is laser marked.

Typical Parameters at T

= 25°C

Part Number Series Resistance Carrier Lifetime Total Capacitance

HSMP- R

(Ω) τ (ns) C

(pF)

389x 3.8 200 0.20 @ 5 V

Test Conditions I

= 1 mA I

= 10 mA

f = 100 MHz I

= 6 mA

Part #	HSMP-389C-TR1
Description	DIODE PIN SWITCH 100V 1A SOT-323
Category	WAFER DIE
Availability	Out of Stock
Qty	0

HSMP-389C-TR1

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Technical Document