74HC_HCT4040_3 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 14 September 2005 2 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
[1] C
PD
is used to determine the dynamic power dissipation (P
D
in µW):
P
D
=C
PD
× V
CC
2
× f
i
+ ∑(C
L
× V
CC
2
× f
o
) where:
f
i
= input frequency in MHz;
f
o
= output frequency in MHz;
∑(C
L
× V
CC
2
× f
o
) = sum of outputs;
C
L
= output load capacitance in pF;
V
CC
= supply voltage in V.
5. Ordering information
f
max
maximum operating
frequency
C
L
= 15 pF; V
CC
= 5 V - 90 - MHz
C
i
input capacitance - 3.5 - pF
C
PD
power dissipation
capacitance
V
I
= GND to V
CC
-20-pF
Type 74HCT4040
t
PHL
, t
PLH
propagation delay
CP to Q0 C
L
= 15 pF; V
CC
= 5 V - 16 - ns
Qn to Qn+1 C
L
= 15 pF; V
CC
=5V - 8 - ns
f
max
maximum operating
frequency
C
L
= 15 pF; V
CC
= 5 V - 79 - MHz
C
i
input capacitance - 3.5 - pF
C
PD
power dissipation
capacitance
V
I
= GND to V
CC
− 1.5 V - 20 - pF
Table 1: Quick reference data
…continued
GND = 0 V; T
amb
=25
°
C; t
r
=t
f
= 6 ns.
Symbol Parameter Conditions Min Typ Max Unit
Table 2: Ordering information
Type number Package
Temperature range Name Description Version
74HC4040N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil);
long body
SOT38-1
74HC4040D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body
width 3.9 mm
SOT109-1
74HC4040DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads; body
width 5.3 mm
SOT338-1
74HC4040PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
74HC4040BQ −40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal enhanced
very thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
SOT763-1
74HCT4040N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil);
long body
SOT38-1
74HCT4040D −40 °C to +125 °C SO16 plastic small outline package; 16 leads; body
width 3.9 mm
SOT109-1
