© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 4
1 Publication Order Number:
MMBT589LT1/D
MMBT589LT1
High Current Surface Mount
PNP Silicon Switching
Transistor for Load
Management in
Portable Applications
Features
• Pb−Free Packages are Available
MAXIMUM RATINGS (T
A
= 25°C)
Rating Symbol Value Unit
Collector−Emitter Voltage V
CEO
−30 Vdc
Collector−Base Voltage V
CBO
−50 Vdc
Emitter−Base Voltage V
EBO
−5.0 Vdc
Collector Current − Continuous I
C
−1.0 Adc
Collector Current − Peak I
CM
−2.0 A
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board,
(Note 1) T
A
= 25°C
Derate above 25°C
P
D
310
2.5
mW
mW/°C
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
q
JA
403 °C/W
Total Device Dissipation Alumina
Substrate, (Note 2) T
A
= 25°C
Derate above 25°C
P
D
710
5.7
mW
mW/°C
Thermal Resistance, Junction−to−Ambient
(Note 2)
R
q
JA
176 °C/W
Total Device Dissipation (Ref. Figure 8)
(Single Pulse < 10 sec.)
P
Dsingle
575 mW
Junction and Storage Temperature T
J
, T
stg
−55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 X 1.0 inch Pad
http://onsemi.com
SOT−23 (TO−236)
CASE 318
STYLE 6
Device Package Shipping
†
ORDERING INFORMATION
MMBT589LT1 SOT−23 3,000 / Tape & Ree
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MMBT589LT1G SOT−23
(Pb−Free)
3,000 / Tape & Ree
1
2
3
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
1
G3 M G
G
G3 = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
30 VOLTS, 2.0 AMPS
PNP TRANSISTORS
COLLECTOR
3
1
BASE
2
EMITTER