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JANTXV2N6762

Part # JANTXV2N6762
Description TRANS MOSFET N-CH 500V 4.5A 2PIN TO-3 - Bulk
Category TRANSISTOR
Availability In Stock
Qty 11
Qty Price
1 - 2 $38.48563
3 - 4 $30.61357
5 - 6 $28.86422
7 - 9 $26.82332
10 + $23.90774
Manufacturer Available Qty
IR/ UNITRODE
Date Code: 8500
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Absolute Maximum Ratings
Parameter Units
I
D
@ V
GS
= 10V, T
C
= 25°C Continuous Drain Current 4.5
I
D
@ V
GS
= 10V, T
C
= 100°C Continuous Drain Current 3.0
I
DM
Pulsed Drain Current 18
P
D
@ T
C
= 25°C Max. Power Dissipation 75 W
Linear Derating Factor 0.6 W/°C
V
GS
Gate-to-Source Voltage ±20 V
E
AS
Single Pulse Avalanche Energy 1.1 mJ
I
AR
Avalanche Current 4.5 A
E
AR
Repetitive Avalanche Energy —mJ
dv/dt Peak Diode Recovery dv/dt 3.5
V/ns
T
J
Operating Junction -55 to 150
T
STG
Storage Temperature Range
Lead Temperature 300 (0.063 in. (1.6mm) from case for 10s)
Weight 11.5 (typical) g
PD - 90336F
o
C
A
01/22/01
www.irf.com 1
Product Summary
Part Number BVDSS RDS(on) ID
IRF430 500V 1.5 4.5A
For footnotes refer to the last page
REPETITIVE AVALANCHE AND dv/dt RATED JANTX2N6762
HEXFET
TRANSISTORS
JANTXV2N6762
THRU-HOLE (TO-204AA/AE)
[REF:MIL-PRF-19500/542]
IRF430
500V, N-CHANNEL
The HEXFET
technology is the key to International
Rectifiers advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resis-
tance combined with high transconductance; superior re-
verse energy and diode recovery dv/dt capability.
The HEXFET transistors also feature all of the well estab-
lished advantages of MOSFETs such as voltage control,
very fast switching, ease of paralleling and temperature
stability of the electrical parameters.
They are well suited for applications such as switching
power supplies, motor controls, inverters, choppers, audio
amplifiers and high energy pulse circuits.
TO-3
Features:
n Repetitive Avalanche Ratings
n Dynamic dv/dt Rating
n Hermetically Sealed
n Simple Drive Requirements
n Ease of Paralleling
IRF430
2 www.irf.com
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
R
thJC
Junction to Case 1.67
R
thJA
Junction to Ambient — 30 Typical socket mount
°C/W
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
I
S
Continuous Source Current (Body Diode) 4.5
I
SM
Pulse Source Current (Body Diode) —— 18
V
SD
Diode Forward Voltage 1.4 V T
j
= 25°C, I
S
=4.5A, V
GS
= 0V
t
rr
Reverse Recovery Time 900 nS T
j
= 25°C, I
F
=4.5A, di/dt 100A/µs
Q
RR
Reverse Recovery Charge 7.0 µc V
DD
50V
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
S
+ L
D
.
A
For footnotes refer to the last page
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BV
DSS
Drain-to-Source Breakdown Voltage 500 V V
GS
= 0V, I
D
= 1.0mA
BV
DSS
/T
J
Temperature Coefficient of Breakdown 0.78 V/°C Reference to 25°C, I
D
= 1.0mA
Voltage
R
DS(on)
Static Drain-to-Source On-State 1.50 V
GS
= 10V, I
D
=3.0A
Resistance 1.80 V
GS
=10V, I
D
=4.5A
V
GS(th)
Gate Threshold Voltage 2.0 4.0 V V
DS
= V
GS
, I
D
=250µA
g
fs
Forward Transconductance 2.7 S ( ) V
DS
> 15V, I
DS
=3.0A
I
DSS
Zero Gate Voltage Drain Current 25 V
DS
=400V, V
GS
=0V
250 V
DS
=400V
V
GS
= 0V, T
J
= 125°C
I
GSS
Gate-to-Source Leakage Forward 100 V
GS
=20V
I
GSS
Gate-to-Source Leakage Reverse -100 V
GS
=-20V
Q
g
Total Gate Charge 16 40 V
GS
=10V, ID
=
4.5A
Q
gs
Gate-to-Source Charge 2.0 6.0 nC V
DS
=250V
Q
gd
Gate-to-Drain (‘Miller’) Charge 8.0 20
t
d(on)
Turn-On Delay Time 30 V
DD
=250V, I
D
=4.5A,
t
r
Rise Time 40 R
G
=7.5
t
d(off)
Turn-Off Delay Time 80
t
f
Fall Time 30
L
S +
L
D
Total Inductance 6.1
C
iss
Input Capacitance 610 V
GS
= 0V, V
DS
=25V
C
oss
Output Capacitance 135 pF f = 1.0MHz
C
rss
Reverse Transfer Capacitance 65
nA
nH
ns
µA
Measured from the center of
drain pad to center of source
pad
www.irf.com 3
IRF430
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
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