Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Fixed Inductors (Chip Inductors)
E
1
L
2
J
3
P
4
A
5
1
6
R
7
5
8
K
9
F
10
F
11
PF
PE
PC
PA
PB
1005 (0402)
1608 (0603)
2520 (1008)
3225 (1210)
4532 (1812)
1.5 nH
10 nH
220 nH
3.3 µH
47 µH
560 µH
1N5
10N
R22
3R3
470
561
±0.3 nH
±5%
±10 %
±20 %
D
J
K
M
Taping
Chip Inductors
Product code Shape
Size : mm (inch)
Inductance Inductance tolerance
Packaging Design No.
4. High Power Type PF, PE, PC, PA, PB
■ Features
● Low DCR and large current capability, suitable for power circuitry.
● Wire wound, resin molded chip inductor. (PC, PA, PB types)
● Unique Ceramic Core/Laser-cut technology (PF, PE type)
● Capable of being Re-fl ow or fl ow soldered.
● Wide line-up from 1005 to 4532 case sizes.
● Good for mounting.
■ Recommended Applications
● AV equipment, Wireless communication equipment and various types of general electronic equipment.
■ Explanation of Part Numbers
■Storage Conditions
●
Package : Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to
direct sunlight and harmful gases and care should be taken so as not to cause dew.
●
Operating Temperature : –20 to +85 °C
■Storage Period
● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specifi ed limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
■Packaging
Refer 27 and 28 page.
■Soldering Conditions
Refer 29 page.
■Safety Precautions
Refer 30 page.
Jul. 2008
