Cinch Connectivity Solutions 12-140

Cross Number:

Item Description: CONN BARRIER BLOCK .375" 12 CIRC

Qty Price
1 - 1 $5.12200
2 - 3 $3.99671
4 - 5 $3.49227
6 - 6 $3.37586
7 + $3.02663



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Cinch Connectivity Solutions
  • Freelance Stock: 8
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Catalog No. C-865
CIN::APSE
®
High Speed
Interconnect Technology
MATERIALS
Contact Material: Molybdenum
CIN::APSE Contact Plating: Gold
Plunger Material: Copper alloy
Plunger Plating: Gold
Insulator Material: Liquid crystal polymer
Packaging Tray Material: Anti-static ABS
ELECTRICAL
Button-Only Configuration with 0.020" (0.5 mm) Diameter
DC Resistance: 15m average
Inductance: Less than 1 nH
Current-Carrying Capability: Up to 3 Amps.
Insulation Resistance: 25,000 Meg @ 500 VDC
Dielectric Withstanding Voltage: 900 VAC at sea level
ENVIRONMENTAL
Button-Only Configuration with 0.020" (0.5 mm) Diameter
Temperature Life Testing: 1000 Hours @ 200°C
Thermal Shock: 2,000 Cycles @ 20°C to 110°C
Humidity: 5,000 Hours @ 30°C to 80°C, 80% RH
Salt Spray: 96 Hours
Low Temperature: Operates in liquid nitrogen (77°K)
Bellcore TR-NWT-001217: Passed with plungers
MECHANICAL
Button-Only Configuration with 0.020" (0.5 mm) diameter
Durability: 25,000 Z-axis actuations (CIN::APSE contact only)
Shock: 100 Gs; 6 milliseconds, no discontinuity
greater than 2 nanoseconds
Vibration: 20 Gs; 10-20,000 Hz; no discontinuity
greater than 2 nanoseconds
FEATURES
High signal speed capability enabling frequencies greater than 20 GHz.
Z-Axis, solderless, compression mount interconnect system.
Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to
PCB, and parallel PCB to PCB interconnections.
Provides solutions to many of the problems associated with through hole and surface mount
soldered technology.
Enables upgrade and system maintenance strategies.
Available in custom I/O configurations and I/O counts from 1 to over 5,000.
Offers low profile capabilities with compressed signal path length as short as 0.8 mm.
Contact centerline spacing of 1mm or greater.
Excellent reliability in commercial, military, and aerospace applications.
Application can result in lower installed and system maintenance costs.
IC Component to Board Socket (LGA)
Flex Circuit to PCB
1-1
Call Toll Free: 1 (800) 323-9612
CIN::APSE
®
High-Speed Interconnect Technology
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Freelance Electronics
13197 Sandoval Street
Santa Fe Springs, CA 90670

Hours of Operation
Monday-Friday 7:30am-4:30pm PST
(Deadline for next day shipment 2:00pm PST)

Trustworthy Standards Serving the Electronic Components
Industry since 1986

Government Cage code#-1V4R6
Duns Number# 788130532
Certified Small Disadvantaged Business