157
Catalog 1307819 Dimensions are in inches and Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-2103-6000
Revised 8-08 millimeters unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628
specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013
www.tycoelectronics.com are metric equivalents. to change. C. America: 52-55-1106-0803 UK: 44-8706-080-208
Receptacle Assemblies with ACTION PIN Posts and Solder Posts
(Non-Intermateable with AMPMODU Connectors)
AMPMODU Interconnection System
Note: All part numbers are RoHS compliant.
Stacking Connectors,
Receptacles
5
For Outer Board
Post
No. of
Dimensions (See Note.)
Receptacle
Type Length Assembly
L
Pos.
AB
Part Nos.
26 35.6 [1.402] 30.48 [1.200] 1-173145-7
30 40.6 [1.598] 35.56 [1.400] 173145-2
ACTION PIN
4.2*
34 45.7 [1.799] 40.64 [1.600] 1-173145-8
Post 40 53.3 [2.098] 48.26 [1.900] 173145-3
50 66.0 [2.598] 60.96 [2.400] 173145-4
60 78.7 [3.098] 73.66 [2.900] 173145-5
26 35.6 [1.402] 30.48 [1.200] 2-173145-8
30 40.6 [1.598] 35.56 [1.400] 2-173145-4
34 45.7 [1.799] 40.64 [1.600] 2-173145-9
Solder Post 4.2* 40 53.3 [2.098] 48.26 [1.900] 2-173145-5
50 66.0 [2.598] 60.96 [2.400] 2-173145-6
60 78.7 [3.098] 73.66 [2.900]
2-173145-7
3-173145-0**
**After mounted receptacle assembly is on board, dimension of extrude length from board is 2.6 [.102].
**Post Length = 17.0 [.669] , Blank Width = 0.69 [.027] (see above figure) (finished hole dia. = 1.0 [.039]).
Receptacle Assembly for
Outer Board (With 0.55
[.022] Square Post)
Material and Finish
Housing — Black glass-filled PBT,
94V-0 rated
Contacts — Copper alloy, plated
0.00020 [.000008] gold on contact area
and post mating area, gold flash on
ACTION PIN tail or 0.000070 [.0000027]
tin on solder tail, with entire contact
underplated 0.00130 [.000050] nickel
Application Tooling shown on
page 162.
PC Board Mounting
Dimensions
Thru hole
plating Copper
0.02500-0.05000
[.000984-.001968]
Land dia.
1.4
[.055]
Min.
Board
Thick
1.6
[.062]
Finished
hole dia.
0.825
±0.05
[.032
±.002
]
PCB drill hole
0.9
±0.025
[.035
±.0001
]
ACTION PIN Post
Board
Thick
1.6
[.062]
Finished
hole dia.
0.8
±0.05
[.031
±.002
]
Solder Post
Recommended PC Board Hole Layout
7.6
[.300]
2.54
[.100]
Pitch
2.54
[.100]
A
B
Y
Y
11.9
[.469]
2.54
[.100]
Pitch
B
X
X
Mating
Area
2.54
[.100]
2.54
[.100]
2.54
[.100]
0.5
[.020]
16.5
[.650]
Blank
width
0.69**
[.027]
6.4
[.252]
Contact
Area
Contact
Area
0.5
[.020]
6.4
[.252]
3.7
[.146]
0.5
[.020]
ACTION
PIN
Area
L
L
Section X-X
Solder Type
2.54
±0.1
[.100
±.004
]
2.54
±0.1
[.100
±.004
]
B
±0.1
[±.004]
Section X-X
ACTION PIN
Type
Section Y-Y
3.7
[.146]
METRIC
Dimensions are
millimeters over inches
