3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnectors.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
Chip Carrier Sockets
Surfacemount 8400 Series
• Accepts chip carriers conforming to JEDEC outline
MO-047 for square and MO-052 for rectangular
• High temperature insulator compatible with IR reflow
and wave soldering
• Compatible with automated loading equipment
• Open top design allows unrestricted air flow
• Molded slots for ease of device extraction
• Available with optional PCB locating posts
• RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the "RoHS Compliance" section
of www.3Mconnector.com for compliance
information (RIA E1 and C1 apply)
Date Modied: September 14, 2011 TS-2147-B
Sheet 1 of 2
Physical
Insulation
Material: Glass Filled Polyphenylene Sulfide (PPS)
Flammability: UL 94V-0
Color: Black
Contact
Material:
Copper Alloy
Plating
Underplating: 50 µ" [ 1.27 µm ] Nickel - Overall
Wiping Area: 160 µ", [ 4.06 µm ] Matte Tin
Electrical
Contact Resistance: 15 mΩ
Insulation Resistance: >10
3
MΩ minimum
Capacitance:
<1 pF at 1 MHz
Environmental
Temperature Rating:
-40ºC to +105ºC
Process Rating:
Maximum 260°C, single pass, (profile per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C)
Notice:
Please be aware that the 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Since tin
whiskers are an inherent characteristic of tin and mechanically stressing the tin is a known driver of whisker growth, it is possible the PLCC and PLCC socket may exhibit tin whisker growth after
mating. 3M follows the iNEMI plating recommendations which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Please consider whether a PLCC
socket is suitable for your particular needs after considering your product applications life span and environment including mechanical stresses, humidity, and thermal cycling all of which have
been shown to stimulate tin whisker growth.
