INTERCONNECTS
2mm Grid Headers and Sockets
Single and Double Row
www.mill-max.com
516-922-6000
70
Series 830, 831
832, 833
Ordering Information
Fig. 1
Fig. 2
Specify # of pins 01-50
Fig. 3
Fig. 4
Specify # of pins 01-50
Single Row Pin Header
830-XX-0_ _-10-001000
Double Row Pin Header
832-XX-_ _ _-10-001000
Specify # of pins 002-100
831-XX-0_ _-10-001000
Double Row Socket
833-XX-_ _ _-10-001000
Specify # of pins 002-100
Single Row Socket
Fig. 1
Fig. 2
Fig. 3
Fig. 4
SPECIFY PLATING CODE XX= 13
91 93 99 41
43
44
Sleeve (Pin)
Contact (Clip)
10µ” Au 200µ” Sn/Pb 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn 200µ”Sn
30µ” Au 10µ” Au
30µ” Au 200µ”Sn/Pb 10µ” Au 30µ” Au 200µ”Sn
Pin Plating
10μ” Au 200μ” Sn/Pb 200μ”Sn
SPECIFY PLATING CODE XX= 10
90 40
• Series 830 single and double row
interconnects have 2mm pin spacing and
permit board stacking as low as .322”.
• Pin headers (830 & 832 series) use MM
#5012 pins. See page 175 for details.
• Sockets (831 & 833 series) use MM #1802
receptacles and accept pin diameters from
.015”-.025”. See page 140 for details.
• Insulators are high temp. thermoplastic,
suitable for all soldering operations.
